IP Library Granted Patent US 7,120,077
Granted Patent B2
US 7,120,077 · App. 10/776,178 · Granted Oct 10, 2006

Memory module having a plurality of integrated memory components

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Quick Facts
Patent No.
US 7,120,077
App. No.
10/776,178
Granted
Oct 10, 2006
Kind
B2
Abstract

A memory module includes a plurality of integrated memory components are arranged on a mounting substrate and a refresh control circuit arranged separately from the memory components on the mounting substrate. The output of the refresh control circuit is connected to the plurality of integrated memory components. The refresh control circuit receives and processes address or command signals which have been generated outside the memory module; based on the access information obtained therefrom, independently generates a refresh command or a refresh command sequence for refreshing the contents of memory cells in a selected one of the memory components; and transmits the command or command sequence to the selected memory component. Refresh commands of this type no longer have to be generated by a memory controller.

Claims (24)

1. A memory module, comprising:

a mounting substrate, wherein the substrate comprises connections for supplying address and command signals;

a plurality of integrated memory components arranged on the mounting substrate, wherein each of the memory components comprises a memory cell array including rows and columns;

a refresh control circuit that is arranged separately from the memory components on the mounting substrate, wherein an output of the refresh control circuit is connected to the plurality of integrated memory components and an input of the refresh control circuit is connected to the connections for supplying the address and command signals; and

a respective set of counter circuits for independently operated units of rows, wherein the individual counter circuits within a set are associated with a respective different row in the corresponding unit of rows, and a respective counter circuit is reset when an associated row is accessed;

wherein the refresh control circuit is designed such that:

when address or command signals, which have been generated outside the memory module, are supplied, the refresh control circuit receives and processes the signals, based on the access information obtained therefrom, the refresh control circuit independently generates a refresh command for refreshing the contents of memory cells in a selected one of the memory components, and the refresh control circuit transmits the refresh command to the selected memory component; and

the refresh control circuit ascertains which rows in a selected memory component have not been accessed in a predefined period of time and, based on this evaluation, the refresh control circuit independently determines a point in time at which the refresh command will be sent, the refresh control circuit being configured to evaluate the counter circuits with respect to a count and, based on such evaluation, independently determining the point in time at which the refresh command will be sent.

2. The memory module as claimed in claim 1 , wherein the refresh control circuit is arranged within a semiconductor chip, the semiconductor chip being separate from the memory components.

3. The memory module as claimed in claim 1 , wherein the input connection of the refresh control circuit is connected to a contact strip on the memory module.

4. The memory module as claimed in claim 1 , wherein the memory module is in the form of a DIMM module arrangement.

5. The memory module as claimed in claim 1 , wherein the memory components in the memory module are dynamic read/write memories.

6. A memory module, comprising:

a mounting substrate, wherein the substrate comprises connections for supplying address and command signals;

a plurality of integrated memory components arranged on the mounting substrate, wherein the memory components each comprises a memory cell array including rows and columns;

a refresh control circuit that is arranged separately from the memory components on the mounting substrate, wherein an output of the refresh control circuit is connected to the plurality of integrated memory components and an input of the refresh control circuit is connected to the connections for supplying the address and command signals; and

a respective set of counter circuits for independently operated units of rows, wherein the individual counter circuits within a set are associated with a respective different row in the corresponding unit of rows, and a respective counter circuit is reset when an associated row is accessed;

wherein the refresh control circuit is designed such that:

when address or command signals, which have been generated outside the memory module, are supplied, the refresh control circuit receives and processes the signals, based on the access information obtained therefrom, the refresh control circuit independently generates a refresh command sequence for refreshing the contents of memory cells in a selected one of the memory components, and the refresh control circuit transmits the command sequence to the selected memory component; and

the refresh control circuit ascertains which rows in a selected memory component have not been accessed in a predefined period of time and, based on this evaluation, the refresh control circuit independently determines a point in time at which the refresh command sequence will be sent, the refresh control circuit being configured to evaluate the counter circuits with respect to a count and, based on such evaluation, independently determining the point in time at which the refresh command sequence will be sent.

7. The memory module as claimed in claim 6 , wherein the refresh control circuit is arranged within a semiconductor chip, the semiconductor chip being separate from the memory components.

8. The memory module as claimed in claim 6 , wherein the input connection of the refresh control circuit is connected to a contact strip on the memory module.

9. The memory module as claimed in claim 6 , wherein the memory module is in the form of a DIMM module arrangement.

10. The memory module as claimed in claim 6 wherein the memory components in the memory module are dynamic read/write memories.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036873/0758 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023821/0535 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2004
From: JAKOBS, ANDREAS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 015344/0685 →