IP Library Granted Patent US 7,061,269
Granted Patent B1
US 7,061,269 · App. 10/843,708 · Granted Jun 13, 2006

I/O buffer architecture for programmable devices

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,061,269
App. No.
10/843,708
Granted
Jun 13, 2006
Kind
B1
Abstract

Programmable devices, such as FPGAs, are designed with I/O buffer architectures having (at least) three different types of I/O buffers: single-ended buffers with Peripheral Component Interconnect (PCI) clamps, single-ended buffers without PCI clamps, and differential buffers without PCI clamps. By distributing these different types of I/O buffers around the periphery of the device, a relatively low-cost device can be implemented with relatively small I/O buffers that collectively provide all of the I/O signaling functionality of prior-art devices that are implemented with relatively large, all-purpose I/O buffers, each of which supports the full range of I/O signaling options available on the device.

Claims (46)

1. A programmable device having programmable input/output (I/O) circuitry and programmable logic connected to receive incoming signals from and provide outgoing signals to the I/O circuitry, the programmable I/O circuitry comprising:

one or more single-ended I/O buffers with PCI clamps;

one or more single-ended I/O buffers without PCI clamps; and

one or more differential I/O buffers without PCI clamps, wherein each I/O buffer is adapted to be programmably coupled to the programmable logic, wherein:

the single-ended I/O buffers with PCI camps are located only on first and third sides of the device;

the single-ended I/O buffers without PCI clamps are located only on second and fourth sides of the device; and

the differential I/O buffers without PCI clamps are located only on the second and fourth sides of the device.

2. The invention of claim 1 , wherein, for every seven I/O buffers on the second and fourth sides of the device:

four of the seven I/O buffers are differential I/O buffers without PCI clamps; and

three of the seven I/O buffers are single-ended I/O buffers without PCI clamps.

3. The invention of claim 1 , wherein:

the first and third sides are the top and bottom sides of the device; and

the second and fourth sides are the right and left sides of the device.

4. The invention of claim 1 , wherein each differential I/O buffer without PCI clamps can be programmably configured to support single-ended signaling.

5. The invention of claim 1 , wherein each differential I/O buffer supports signaling conforming to at least one LVDS standard.

6. The invention of claim 1 , wherein each single-ended I/O buffer with PCI clamps supports signaling conforming to at least one PCI standard.

7. The invention of claim 6 , wherein each single-ended I/O buffer with PCI clamps supports signaling conforming to PCI33 standard.

8. The invention of claim 1 , wherein each I/O buffer supports signaling conforming to at least one LVTTL standard, at least one LVCMOS standard, at least one SSTL standard, and at least one HSTL standard.

9. The invention of claim 8 , wherein each I/O buffer supports signaling conforming to LVTTL, LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVCMOS12, SSTL18_I, SSTL2_I, SSTL2_II, SSTL3_I, SSTL3_II, HSTL15_I, HSTL15_III, HSTL18_I, HSTL18_II, and HSTL18_III standards.

10. The invention of claim 1 , wherein:

each differential I/O buffer can be configured to support single-ended signaling;

each differential I/O buffer supports signaling conforming to at least one LVDS standard;

each single-ended I/O buffer with PCI clamps supports signaling conforming to at least one PCI standard; and

each I/O buffer supports signaling conforming to at least one LVTTL standard, at least one LVCMOS standard, at least one SSTL standard, and at least one HSTL standard.

11. The invention of claim 10 , wherein:

for every seven I/O buffers on the second and fourth sides of the device:

four of the seven I/O buffers are differential I/O buffers without PCI clamps; and

three of the seven I/O buffers are single-ended I/O buffers without PCI clamps

the first and third sides are the top and bottom sides of the device;

the second and fourth sides are the right and left sides of the device;

each single-ended I/O buffer with PCI clamps supports signaling conforming to PCI33 standard; and

each I/O buffer supports signaling conforming to LVTTL, LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVCMOS12, SSTL18_I, SSTL2_I, SSTL2_II, SSTL3_I, SSTL3_II, HSTL15_I, HSTL15_III, HSTL18_I, HSTL18_II, and HSTL18_μIII standards.

12. A programmable device having programmable input/output (I/O) circuitry and programmable logic connected to receive incoming signals from and provide outgoing signals to the I/O circuitry, the programmable I/O circuitry comprising:

one or more single-ended I/O buffers with PCI clamps located only on first and third sides of the device; and

one or more single-ended I/O buffers without PCI clamps located only on second and fourth sides of the device,

wherein each I/O buffer is adapted to be programmably coupled to the programmable logic.

13. A programmable device having programmable input/output (I/O) circuitry and programmable logic connected to receive incoming signals from and provide outgoing signals to the I/O circuitry, the programmable I/O circuitry comprising:

one or more single-ended I/O buffers with PCI clamps located only on first and third sides of the device; and

one or more differential I/O buffers without PCI clamps located only on second and fourth sides of the device,

wherein each I/O buffer is adapted to be programmably coupled to the programmable logic.

14. The invention of claim 12 , wherein each single-ended I/O buffer with PCI clamps supports signaling conforming to at least one PCI standard.

15. The invention of claim 12 , wherein each I/O buffer supports signaling conforming to at least one LVTTL standard, at least one LVCMOS standard, at least one SSTL standard, and at least one HSTL standard.

16. The invention of claim 13 , wherein each differential I/O buffer without PCI clamps can be programmably configured to support single-ended signaling.

17. The invention of claim 13 , wherein each differential I/O buffer supports signaling conforming to at least one LVDS standard.

18. The invention of claim 13 , wherein each single-ended I/O buffer with PCI clamps supports signaling conforming to at least one PCI standard.

19. The invention of claim 13 , wherein each I/O buffer supports signaling conforming to at least one LVTTL standard, at least one LVCMOS standard, at least one SSTL standard, and at least one HSTL standard.

Assignments (3)
SECURITY INTEREST Recorded May 21, 2019
From: LATTICE SEMICONDUCTOR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 049980/0786 →
RELEASE OF SECURITY INTEREST Recorded May 21, 2019
From: JEFFERIES FINANCE LLC
To: LATTICE SEMICONDUCTOR CORPORATION; SILICON IMAGE, INC.; SIBEAM, INC.; DVDO, INC.
Reel/Frame 049827/0326 →
SECURITY INTEREST Recorded Mar 18, 2015
From: LATTICE SEMICONDUCTOR CORPORATION; SIBEAM, INC.; SILICON IMAGE, INC.; DVDO, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 035222/0866 →