Method of forming a leadframe for a semiconductor package
View Patent ↗A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
1. A method of forming a leadframe for a semiconductor package comprising:
providing a leadframe panel having a top surface and a bottom surface;
forming a first indentation an a bottom surface of the leadframe panel;
forming a second indentation on the bottom surface of the leadframe panel wherein a first portion of the bottom surface is between the first indentation and the second indentation; and
forming an opening from the top surface through the leadframe panel and overlapping a portion of the first indentation and a portion of the second indentation;
wherein the opening completely removes the first portion of the bottom surface.
2. The method of claim 1 wherein forming the first indentation on the bottom surface includes forcing an object into the bottom surface to form the first indentation.
3. The method of claim 1 wherein forming the first indentation on the bottom surface includes forming an angle greater than ninety degrees between the bottom surface and a side of the first indentation.
4. The method of claim 1 wherein forming the first indentation on the bottom surface includes coining the first indentation.
5. The method of claim 1 wherein forming the opening from the top surface through the leadframe panel and overlapping the portion of the first indentation includes forcing an object through the top surface to form the opening.
6. The method of claim 1 wherein forming the opening from the top surface through the leadframe panel and overlapping the portion of the first indentation includes punching the opening through the top surface.
7. The method of claim 1 wherein forming the first indentation on the bottom surface includes forming the first indentation extending no greater than seventy-five per cent of a distance through the leadframe panel.
8. The method of claim 1 wherein forming the opening from the top surface through the leadframe panel and overlapping the portion of the first indentation includes overlapping up to one-half of the indentation.
9. The method of claim 1 wherein forming the first indentation on the bottom surface includes forming the first indentation having a shape that is one of an inverted Vshape, a semicircular shape, a three sided shape, or a five sided shape.
10. The method of claim 1 further including encapsulating the leadframe to form a semiconductor package.
11. The method of claim 1 wherein providing the leadframe panel includes providing a blank leadframe panel.