Arrangement for reducing stress in substrate-based chip packages
View Patent ↗An arrangement reduces stress in substrate-based chip packages, in particular of Ball Grid Arrays (BGA) with rear-side and/or edge protection. The chip is firmly connected to a substrate, which is provided on the side that is opposite from the chip with conducting tracks and micro-balls for making electrical contact with the next-higher wiring level. Regular trench-shaped structures are introduced into the substrate on the chip side thereof and at least enclosing the chip, in order to interrupt or shift the thermally induced mechanical stress in the substrate, indicated by the chip.
1. A substrate-based chip package comprising:
a semiconductor chip; and
a substrate including a first side connected to the semiconductor chip, the substrate including a second side that is opposite from the first side, wherein the first side of the substrate includes stress releasing trench-shaped structures formed around the periphery of the semiconductor chip, said trench-shaved structures extending from said first side and partly into, but not through said substrate, and said substrate also defining a bonding channel extending from said first side through said substrate to said second side for passing bonding wire therethrough.
2. The package of claim 1 wherein the substrate includes conducting tracks formed therein, the package further including micro-balls electrically coupled to the conducting tracks, the micro-balls for making electrical contact with the next-higher wiring level.
3. The package of claim 1 wherein the trench-shaped structures enclose the chip.
4. The package of claim 1 wherein the trench-shaped structures are provided in order to interrupt or shift thermally induced mechanical stress in the substrate.
5. The package of claim 1 wherein the trench-shaped structures are etched into the substrate.
6. The package of claim 1 wherein the trench-shaped structures are introduced by machining.
7. The package of claim 1 and further comprising a solder resist material disposed on the first side of the substrate.
8. The package of claim 7 wherein the solder resist material is applied after introducing the trench-shaped structures into the substrate.
9. The package of claim 7 wherein the trench-shaped structures are formed in the substrate through the solder resist material.
10. The package of claim 1 wherein the trench-shaped structures enclose the chip in the form of a frame.
11. The package of claim 10 wherein the trench-shaped structures comprise a number of frame-shaped structures spaced apart one inside the other.
12. The package of claim 1 wherein the trench-shaped structures are at least partly filled by a moulding compound.
13. The package of claim 1 wherein the trench-shaped structures are introduced into a matrix of the substrate.
14. The arrangement of claim 13 wherein the chip package comprises a Ball Grid Array (BGA) with rear-side and/or edge protection.
15. A substrate-based chip package comprising:
a semiconductor chip;
a substrate including a first side connected to the semiconductor chip, the substrate including a second side that is opposite from the first side. wherein the first side of the substrate includes a number of frame-shaped trench structures spaced apart and one inside the other in a periphery around the semiconductor chip; and
further trenches arranged between the frame-shaped trench structures underneath the chip.
16. The package of claim 15 wherein the further trenches run parallel to the longitudinal edges of the chip.
17. The package of claim 15 wherein the further trenches run parallel to the transverse edges of the chip.
18. The package of claim 15 wherein some of the further trenches run parallel to the longitudinal edges of the chip and wherein others of the further trenches run parallel to the transverse edges of the chip.
19. An arrangement for reducing stress in substrate-based chip packages, the chip being firmly connected to a substrate which is provided on the side that is opposite from the chip with conducting tracks and micro-balls for making electrical contact with the next-higher wiring level, characterized in that regular trench-shaped structures extending partly into, but not through the substrate on the chip-side thereof and at least enclose the chip, in order to interrupt or shift the thermally induced mechanical stress in the substrate, indicated by the chip. and said substrate defining a bonding channel extending through said substrate for passing bonding wires therethrough.