Method for making contacts in a high-density memory

1. A method of forming a contact comprising:

depositing a first part of an electrode above and directly on an antifuse;

after depositing the first part of the electrode, patterning and etching to form a contact void;

after the patterning and etching step, depositing a second part of the electrode above and directly on the first part of the electrode, wherein

the electrode does not comprise silicon.

2. The method of claim 1 , wherein the electrode comprises TiN.

3. A method of forming a contact in a memory array, said method comprising:

depositing a conductive layer over and in contact with a plurality of antifuses, wherein said antifuses are part of a story of active devices formed above a substrate;

patterning and etching said conductive layer and insulating dielectric to form a contact void; and

filling the contact void, wherein the conductive layer does not comprise silicon.

4. The method of claim 3 , wherein the conductive layer is TiN.

5. A method of forming a contact in a memory array, said method comprising:

depositing a first conductive layer over and in contact with a critical film, wherein said critical film is part of a story of active devices formed above a substrate;

patterning and etching said first conductive layer and insulating dielectric to form a contact void; and

depositing a second conductive layer directly on said first conductive layer, wherein said second conductive layer also lines said contact void.

6. The method of claim 5 , wherein the critical film is an antifuse.