Continuous contour polishing of a multi-material surface
View Patent ↗A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.
1. A chemical-mechanical polishing pad comprising:
(a) a resilient subpad, and
(b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad by electrostatic interaction and without the use of an adhesive compound.
2. The polishing pad of claim 1 , wherein the polymeric polishing film has a Shore A hardness of about 50 to 100.
3. The polishing pad of claim 1 , wherein the polymeric polishing film is substantially unfilled.
4. The polishing pad of claim 1 , wherein the polishing pad further comprises an adhesive compound positioned between the back surface of the polymeric polishing film and the resilient subpad only on one or more areas of the subpad that are disposed beneath one or more areas of the polishing surface that are not used during polishing.
5. The polishing pad of claim 1 , wherein the polymeric polishing film comprises a material selected from the group consisting of polycarbonate, polyester, nylon, polyvinyl chloride, and combinations thereof.
6. The polishing pad of claim 1 , wherein the surface roughness (Ra) of the polishing surface of the polymeric polishing film is about 0.5 μm or greater.
7. The polishing pad of claim 1 , wherein the polymeric polishing film has a thickness of about 0.3 mm or less.
8. The polishing pad of claim 1 , wherein the resilient subpad has a thickness of about 0.1 mm or more.
9. The polishing pad of claim 1 , wherein the polymeric polishing film has a thickness that is about 50% or less of the combined thickness of the polymeric polishing film and the subpad.
10. The polishing pact of claim 1 , wherein the resilient subpad has a Shore A hardness of about 100 or less.
11. The polishing pad of claim 1 , wherein the resilient subpad has a Shore A hardness that is about 10–100% of the Shore A hardness of the polymeric polishing film.
12. The polishing pad of claim 1 , wherein the resilient subpad comprises polyurethane.
13. A chemical-mechanical polishing pad comprising:
(a) a resilient subpad, and
(b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad, further comprising a non-adhesive liquid medium positioned between the back surface of the polymeric polishing film and the resilient subpad, wherein the back surface of the polymeric polishing film is releasably associated with the resilient subpad by capillary forces.
14. The polishing pad of claim 13 , wherein the non-adhesive liquid medium is a polishing composition.