Granted Patent B2

US 7,202,106 · App. 10/877,327 · Granted Apr 10, 2007

Abstract

Claims (23)

1. A method of forming a multi-chip connector comprising:

forming a first semiconductor die attachment area on a first surface of a first conductive strip;

forming a second semiconductor die attachment area on a first surface of a second conductive strip; and

attaching a second surface of the first conductive strip to a second surface of the second conductive strip wherein the first semiconductor die attachment area on the first surface of the first conductive strip and the first semiconductor die attachment area on the first surface of the second conductive strip are each configured to provide both a mechanical attachment to a semiconductor die and a point for making an electrical connection to the semiconductor die.

2. The method of claim 1 wherein forming the first semiconductor die attachment area on the first conductive strip includes forming a raised semiconductor die attachment area.

3. The method of claim 1 wherein forming the second semiconductor die attachment area on the first surface of the second conductive strip includes forming a raised semiconductor die attachment area.

4. The method of claim 1 wherein attaching the second surface of the first conductive strip to the second surface of the second conductive strip includes attaching the second surface of the first conductive strip to a first surface of an insulator and attaching the second surface of the second conductive strip to a second surface of the insulator.

5. The method of claim 1 wherein attaching the second surface of the first conductive strip to the second surface of the second conductive strip includes attaching the second surface of the first conductive strip to a first surface of a semiconductor die and attaching the second surface of the second conductive strip to a second surface of the semiconductor die.

6. The method of claim 1 further including forming the first conductive strip as a portion of a first leadframe strip of a first leadframe panel and forming the second conductive strip as a portion of a first leadframe strip of a second leadframe panel.

7. A method of forming a multi-chip connector comprising:

forming a first semiconductor die attachment area on a first surface of a first conductive strip as one of a ball-bond semiconductor die attachment area or a solder semiconductor die attachment or a portion of a material used to form the first conductive strip;

forming a second semiconductor die attachment area on a first surface of a second conductive strip as one of a ball-bond semiconductor die attachment area or a solder semiconductor die attachment or a portion of a material used to form the second conductive strip; and

attaching a second surface of the first conductive strip to a second surface of the second conductive strip.

8. A method of forming a multi-chip connector comprising:

forming a first semiconductor die attachment area on a first surface of a first conductive strip;

forming a second semiconductor die attachment area on a first surface of a second conductive strip; and

attaching a second surface of the first conductive strip to a second surface of the second conductive strip wherein the first semiconductor die attachment area on the first surface of the first conductive strip and the first semiconductor die attachment area on the first surface of the second conductive strip are configured to provide a direct electrical connection to a semiconductor die without the use of bonding wires.

9. The method of claim 8 wherein forming the first semiconductor die attachment area on the first conductive strip includes forming a raised semiconductor die attachment area.

10. The method of claim 8 wherein forming the second semiconductor die attachment area on the first surface of the second conductive strip includes forming a raised semiconductor die attachment area.

11. The method of claim 8 wherein forming the first semiconductor die attachment area and forming the second semiconductor die attachment area includes forming one of a ball-bond semiconductor die attachment area or a solder semiconductor die attachment or a portion of a material used to form which the first conductive strip.

12. The method of claim 8 wherein attaching the second surface of the first conductive strip to the second surface of the second conductive strip includes attaching the second surface of the first conductive strip to a first surface of an insulator and attaching the second surface of the second conductive strip to a second surface of the insulator.

13. The method of claim 8 wherein attaching the second surface of the first conductive strip to the second surface of the second conductive strip includes attaching the second surface of the first conductive strip to a first surface of a semiconductor die and attaching the second surface of the second conductive strip to a second surface of the semiconductor die.

14. The method of claim 8 further including forming the first conductive strip as a portion of a first leadframe strip of a first leadframe panel and forming the second conductive strip as a portion of a first leadframe strip of a second leadframe panel.

Assignments (7)