Semi-conductor memory component, and a process for operating a semi-conductor memory component

1. A process for operating a semi-conductor memory component, comprising:

activating memory cells of a memory cell array, included in a first set of memory cells in a same row or column of the memory cell array, when at least one of the memory cells included in the first set requires access;

accessing a corresponding memory cell or memory cells;

deactivating the memory cells included in the first set of memory cells, when access to at least one further memory cell, not included in the first set of memory cells, occurs; and

prematurely deactivating the memory cells included in the first set of memory cells when a pre-determined time or number of pulses after the at least one of the memory cells included in the first set of memory cells have last been accessed, and no further accessing of the at least one of the memory cells included in the first set of memory cells occurs within the predetermined time or number of pulses.

2. The process according to claim 1 , wherein the semi-conductor memory component comprises a plurality of memory cell arrays.

3. The process according to claim 2 , wherein the premature deactivation is decentrally controlled for each memory cell array by a decentralized control device allocated thereto.

4. The process according to claim 3 , wherein the decentralized control device includes a timer and/or counter device.

5. The process according to claim 3 , wherein the decentralized control device is arranged on the semi-conductor memory component and in proximity to or adjacent to the respective memory cell array.

6. The process according to claim 2 , wherein the non-premature deactivation is centrally controlled for the plurality of memory cell arrays by a central control device centrally allocated to the several memory cell arrays.

7. The process according to claim 6 , wherein the central control device is located separate from the semi-conductor memory component.

8. The process according to claim 6 , wherein a data value determining the pre-determined time or number of pulses, after which the memory cells included in the first set of memory cells should be prematurely deactivated, is written into a register by the central control device.

9. The process according to claim 8 , wherein the data value stored in the register is transferred to the decentralized control device and to a timer and/or counter device.

10. A semi-conductor memory component, comprising:

an array control device for activating memory cells included in a first set of memory cells of a corresponding memory cell array, where the memory cells are located in a same row or column of the memory cell array, in reaction to an activation signal being received from a central control device, and for deactivating the memory cells included in the first set of memory cells in reaction to a deactivation signal being received from the central control device, wherein

the array control device prematurely deactivates the memory cells included in the first set of memory cells, when a predetermined time period or number of pulses after at least one of the memory cells included in the first set of memory cells have last been accessed, and no further accessing of the at least one memory cells included in the first set of memory cells occurs within the predetermined time or number of pulses.

11. The semi-conductor memory component of claim 10 , further comprising memory cells.

12. The semi-conductor memory component of claim 11 , wherein the memory cells comprise DRAM memory cells.

13. The semi-conductor memory component of claim 11 , wherein the memory cells comprise a word line.

14. The semi-conductor memory component of claim 11 , wherein the activating memory cells comprises activating the word line.

15. A semiconductor device comprising:

a memory cell array;

a state machine coupled to the memory cell array, the state machine comprising,

an activation input,

a deactivation input, and

an automatic deactivation input, wherein the state machine activates the memory cell array when the activation input is asserted, and wherein the state machine deactivates the memory cell array when the deactivation or automatic deactivation input is asserted;

a timer comprising,

a reset input, wherein the time is reset when the reset input is asserted, and

a deactivation output signal coupled to the automatic deactivation input of the state machine, wherein the deactivation output signal is asserted a predetermined period of time after the timer is reset; and

a read/write detector comprising a command input and a reset output coupled to the reset input of the timer, wherein the reset output is asserted when the read/write detector detects a read command or a write command.

16. The semiconductor device of claim 15 , wherein the memory cell array comprises a DRAM memory cell array.

17. The semiconductor device of claim 16 , wherein the deactivation signal comprises a pre-charge command signal.

18. The semiconductor device of claim 15 , wherein the state machine deactivates the memory cell array the predetermined period of time after the read/write detector receives a read or write command when no further read/or write command is detected within the predetermined period of time and when no deactivation command is asserted within the predetermined period of time.

19. The semiconductor device of claim 15 , wherein the timer comprises a counter.

20. The semiconductor device of claim 18 , wherein the time further comprises a maximum count input, and wherein the maximum count input corresponds to the predetermined time.