IP Library Granted Patent US 7,221,175
Granted Patent B2
US 7,221,175 · App. 10/908,433 · Granted May 22, 2007

Self-aligning docking system for electronic device testing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,221,175
App. No.
10/908,433
Granted
May 22, 2007
Kind
B2
Abstract

A system for docking a device handler for an electrical device with a test head includes providing a device handler for holding the electrical device, the device handler having a plurality of docking pins. A test head having a plurality of docking modules mounted thereon is provided. The plurality of docking pins is aligned with the plurality of docking modules. The plurality of docking pins is inserted into the plurality of docking modules. The plurality of docking pins is secured in the plurality of docking modules in a docked position to connect the device handler to the test head.

Claims (45)

1. A method for docking a device handler for an electrical device with a test head, comprising:

providing a device handler for holding the electrical device, the device handler having a plurality of docking pins;

providing a test head having a plurality of docking modules mounted comprises:

providing a plurality of docking modules having a collet for grasping the docking pin; and

providing a means for collapsing the collet around the docking pin;

aligning the plurality of docking pins with the plurality of docking modules;

inserting the plurality of docking pins into the plurality of docking modules; and

securing the plurality of docking pins in the plurality of docking modules in a docked position to connect the device handler to the test head.

2. The method as claimed in claim 1 , wherein:

providing a device handler having a plurality of docking pins provides a plurality of docking pins having a pilot diameter and a locating diameter; and

inserting the plurality of docking pins into the plurality of docking modules, further comprises:

inserting the pilot diameter of the plurality of docking pins into the plurality of docking modules to position the device handler with respect to the test head; and

inserting the locating diameter of the plurality of docking pins into the plurality of docking modules; and

securing the plurality of docking pins in the plurality of docking modules in a docked position secures the pilot diameter of the plurality of docking pins.

3. The method as claimed in claim 1 , wherein:

providing a device handler having a plurality of docking pins, further comprises:

providing a main handler plate;

providing a plurality of pitching plates positioned in the main handler plate; and

attaching the plurality of docking pins to the plurality of pitching plates.

4. The method as claimed in claim 1 , wherein:

securing the plurality of docking pins in the plurality of docking modules in a docked position further comprises:

substantially simultaneously securing the plurality of docking pins in the plurality of docking modules.

5. A method for docking a device handler for an electrical device with a test head, comprising:

providing a main handler plate having a handler electrical contact for holding the electrical device;

providing a plurality of pitching plates attached to the main handler plate;

attaching a plurality of docking pins to the plurality of pitching plates;

providing a test head having a test head electrical contact that connects to the handler electrical contact comprises:

providing a plurality of docking modules having a collet for grasping the docking pin; and

providing a means for collapsing the collet around the docking pin;

attaching a plurality of docking modules to the test head;

aligning the plurality of docking pins with the plurality of docking modules;

inserting the plurality of docking pins into the plurality of docking modules whereby the handler electrical contact connects to the test head electrical contact; and

securing the plurality of docking pins in the plurality of docking modules in a docked position to connect the device handler to the test head.

6. The method as claimed in claim 5 , wherein:

attaching a plurality of docking pins to the plurality of pitching plates attaches a plurality of docking pins having a pilot diameter and a locating diameter; and

inserting the plurality of docking pins into the plurality of docking modules, further comprises:

inserting the pilot diameter of the plurality of docking pins into the plurality of docking modules to position the device handler with respect to the test head; and

inserting the locating diameter of the plurality of docking pins into the plurality of docking modules; and

securing the plurality of docking pins in the plurality of docking modules in a docked position secures the pilot diameter of the plurality of docking pins.

7. The method as claimed in claim 5 , wherein:

providing a plurality of pitching plates attached to the device handler provides a plurality of pitching plates having a plurality of pitching holes, wherein:

associated ones of the plurality of pitching holes in a group of pitching plates define a set-up location for the plurality of docking pins.

8. The method as claimed in claim 5 , wherein:

securing the plurality of docking pins in the plurality of docking modules in a docked position further comprises:

substantially simultaneously securing the plurality of docking pins in the plurality of docking modules.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052938/0305 →
CHANGE OF NAME Recorded Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0343 →
SECURITY INTEREST Recorded Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2005
From: RAMAMOORTHI, RAMESH
To: STATS CHIPPAC LTD.
Reel/Frame 016001/0815 →