Method for fabricating an integrated circuit device with through-plating elements and terminal units
View Patent ↗A method for fabricating an integrated circuit device, an electrically conductive substrate being provided, an insulation layer being deposited on the substrate, the insulation layer being etched in structures, a contact-making layer being deposited on the patterned insulation layer and on the substrate in depressions which have first and second lateral dimensions, the contact-making layer being etched back in such a way that the contact-making layer is preserved in the structures with the depressions which have first lateral dimensions of the order of magnitude of the structure depth of the insulation layer and the contact-making layer is removed in the structures with depressions which have second lateral dimensions significantly greater than the structure depth of the insulation layer.
1. A method for fabricating an integrated circuit device, comprising:
a) providing an electrically conductive substrate;
b) depositing an insulation layer on the substrate;
c) etching depressions into the insulation layer which have a structure depth corresponding to a layer thickness of the insulation layer;
d) depositing a contact-making layer onto the patterned insulation layer and onto the substrate in the depressions, the depressions having first lateral dimensions which are less than a layer thickness of the contact-making layer and second lateral dimensions which are significantly greater than the layer thickness;
e) etching back the contact-making layer such that
e1) the contact-making layer is preserved in the structures with the depressions which have the first lateral dimensions, and
e2) the contact-making layer is removed in the structures with the depressions which have the second lateral dimensions; and
f) depositing a connecting layer on the substrate in the depressions which have the second lateral dimensions on the patterned insulation layer and on the etched-back contact-making layer which is included in the depressions having the first lateral dimensions.
2. The method according to claim 1 , wherein, in (d), the contact-making layer is deposited such that the depressions which have the first lateral dimensions are filled to a higher level than the depressions which have the second lateral dimensions.
3. The method according to claim 1 , wherein the substrate is provided as a first metal layer.
4. The method according to claim 1 , wherein the insulation layer which is deposited on the substrate is formed as a silicon dioxide layer.
5. The method according to claim 1 , wherein through-plating elements are formed in the structures of the insulation layer which have the depressions with the first lateral dimensions.
6. The method according to claim 1 , wherein high-power through-plating elements having a high current-carrying capacity and/or a low resistance are formed in the structures of the insulation layer which have the depressions with the second lateral dimensions.
7. The method according to claim 1 , wherein terminal units that provide for external components to make contact with the integrated circuit device are formed in the structures of the insulation layer which have the depressions with the second lateral dimensions.
8. The method according to claim 7 , wherein the terminal units formed in the structures of the insulation layer which have the depressions with the second lateral dimensions are bonded.
9. The method according to claim 1 , wherein the contact-making layer is fabricated on the patterned insulation layer and on the substrate in the depressions which have the first and second lateral dimensions, by deposition of tungsten material by means of chemical vapor deposition.
10. The method according to claim 1 , wherein the connecting layer is provided as a second metal layer.
11. The method according to claim 3 , wherein the first and second metal layers are provided from the same material.
12. The method according to claim 3 , wherein the first and/or the second metal layer are formed from an aluminum material.
13. An integrated circuit device, where fabrication of the intergrated circuit decice comprises:
a) providing an electrically conductive substrate;
b) depositing an insulation layer on the substrate;
c) etching depressions into the insulation layer which have a structure depth corresponding to a layer thickness of the insulation layer;
d) depositing a contact-making layer onto the patterned insulation layer and onto the substrate in the depressions, the depressions having first lateral dimensions which are less than a layer thickness of the contact-making layer and second lateral dimensions which are significantly greater than the layer thickness;
e) etching back the contact-making layer such that
e1) the contact-making layer is preserved in the structures with the depressions which have the first lateral dimensions, and
e2) the contact-making layer is removed in the structures with the depressions which have the second lateral dimensions; and
f) depositing a connecting layer on the substrate in the depressions which have the second lateral dimensions on the patterned insulation layer and on the etched-back contact-making layer which is included in the depressions having the first lateral dimensions.