Method of producing an integrated circuit arrangement with field-shaping electrical conductor
An integrated circuit arrangement includes at least one electrical conductor that, when a current flows through it, produces a magnetic field that acts on at least a further part of the circuit arrangement, wherein seen in cross section, the electrical conductor has at least one recess or depression, or a region of reduced conductivity on the side facing that part, in order to influence the magnetic field which can be produced.
1. A method for producing an integrated circuit arrangement having one or more electrical conductors lying in a plane, which comprises:
producing a further part in the form of a layer that can be influenced by a magnetic field, and subsequently carrying out the following steps:
producing a material layer of nonconductive material corresponding to a position of an electrical conductor to be produced subsequently;
reducing at least one of a thickness and a width of the material layer;
applying an electrical conductor covering the material layer.
2. The method according to claim 1 , wherein a varnish, which is exposed and developed before reduction, is used as the material.
3. The method according to claim 2 , wherein the varnish is incinerated for reduction.
4. The method according to claim 1 , wherein a nonconductive metal or a nonconductive natural antiferromagnet is used as the material.
5. The method according to claim 4 , wherein a nonconductive phase of tantalum is used as the material.
6. The method according to claim 4 , wherein the nonconductive metal or the antiferromagnet is etched for reduction.