IP Library Granted Patent US 7,247,250
Granted Patent B2
US 7,247,250 · App. 10/964,357 · Granted Jul 24, 2007

Method for manufacturing a fast heat rise resistor

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Quick Facts
Patent No.
US 7,247,250
App. No.
10/964,357
Granted
Jul 24, 2007
Kind
B2
Abstract

A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.

Claims (19)

1. A method of manufacturing a fast heat rise resistor comprising,

affixing a layer of a film to a substrate;

applying a photoresist print and developing process to selectively remove portions of the film;

affixing a conductor plated foil to the film and the substrate, wherein at least a portion of the conductor plated foil directly contacts the substrate; and

selectively etching away portions of the conductor plating and the foil to leave a foil trace of a certain width.

2. The method of claim 1 wherein the film is a polyimide film.

3. The method of claim 1 wherein the substrate is polyimide.

4. The method of claim 1 wherein the conductor plating is copper.

5. The method of claim 1 wherein the foil is Ni/Cr.

6. The method of claim 1 wherein the etching step further comprising:

selectively etching away portions of said conductor plating to leave a foil trace;

selectively etching away portions of said foil trace to leave a foil trace of a certain width.

7. The method of claim 6 wherein the foil trace's upper and lower surfaces are exposed to an atmosphere.

8. The method of claim 1 wherein the developing process exposes the substrate.

9. A method of manufacturing a fast heat rise resistor comprising, affixing a layer of a film to a substrate;

applying a photoresist print and developing process to selectively remove portions of the film;

affixing a conductor plated foil to the film and the substrate;

selectively etching away portions of the conductor plating to leave a foil trace wherein the foil trace's upper and lower surfaces are exposed to an atmosphere; and

selectively etching away portions of said foil trace to leave a foil trace of a certain width.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →