IP Library Granted Patent US 7,351,613
Granted Patent B2
US 7,351,613 · App. 10/983,314 · Granted Apr 1, 2008

Method of trimming semiconductor elements with electrical resistance feedback

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Quick Facts
Patent No.
US 7,351,613
App. No.
10/983,314
Granted
Apr 1, 2008
Kind
B2
Abstract

A method of trimming down the volume of a semiconductor resistor element using electrical resistance feedback. After forming conductive material disposed between a pair of electrodes, a voltage is applied to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion of the conductive material. By reducing the volume of the conductive material, its resistance is increased. The application of the voltage is ceased once the desired dimensions (and thus resistivity) of the conductive material is reached. The resulting semiconductor resistor element could have a fixed resistance, or could have a variable resistance (by using phase change memory material).

Claims (18)

1. A method of trimming down a volume of conductive material disposed between a pair of electrodes, the method comprising:

applying a first voltage to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion of the conductive material;

measuring a resistivity of the conductive material; and

ceasing the application of the first voltage in response to the measured resistivity reaching a predetermined value.

2. The method of claim 1 , further comprising:

forming a neck portion of reduced cross sectional area in the conductive material.

3. The method of claim 2 , wherein the heat from the electrical current reduces the cross sectional area of the neck portion.

4. The method of claim 3 , wherein the melting away of the portion of the conductive material increases a resistivity of the neck portion.

5. The method of claim 1 , wherein the conductive material is configured into a strip, and wherein a resistivity of the strip increases as the portion of the conductive material is melted away.

6. The method of claim 5 , wherein the strip includes a neck portion of reduced cross sectional area from which the conductive material is melted away by the heat produced from the electrical current.

7. The method of claim 1 , wherein the first voltage is constant, ramped or pulsed.

8. The method of claim 1 , wherein the first voltage and the electrical current are pulsed, and wherein the measuring of the resistivity of the conductive material is performed in-between the electrical current pulses.

9. The method of claim 1 , wherein the first voltage and the electrical current have constant amplitudes.

10. The method of claim 1 , wherein the conductive material is formed of phase change memory material.

11. The method of claim 10 , further comprising:

applying a second voltage lower than the first voltage to the electrodes to produce a second electrical current through the phase change memory material sufficient to amorphousize or crystallize the phase change memory material.

12. The method of claim 11 , further comprising:

measuring a resistivity of the phase change memory material after the application of the second voltage.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 059687/0344 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: SILICON STORAGE TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 4, 2004
From: CHEN, BOMY; LIN, YA-FEN; SONG, ZHITANG; FENG, SONGLIN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 015970/0949 →