Controlled electroless plating
View Patent ↗An electroless metal deposition process to make a semiconductor device uses a plating bath solution having a reducing agent. A sample of the bath solution is taken and the pH of the sample is increased. The hydrogen evolved from the sample is measured. The hydrogen evolved is used to determine the concentration of the reducing agent present in the sample. Based on the determined reducing agent concentration, the plating bath solution is modified.
1. A method of making a semiconductor device, comprising:
providing a device structure having an active circuit region and a copper interconnect that is over and insulated from the active circuit region, wherein the copper interconnect has a top surface that is exposed;
providing a plating bath having a reducing agent;
obtaining a sample of the plating bath;
increasing pH of the sample;
measuring a quantity of hydrogen evolved from the sample;
using the quantity of hydrogen measured in the step of measuring to determine a concentration of the reducing agent present in the sample; and
plating the top surface of the copper interconnect to form a layer of an alloy of cobalt on the top surface by immersing the device structure in the plating bath if the concentration of the reducing agent is within a predetermined range.
2. The method of claim 1 , wherein the step of increasing the pH comprises adding a hydroxide to the sample.
3. The method of claim 1 , wherein the reducing agent comprises morpholine borane.
4. The method of claim 1 , wherein the reducing agent is characterized as producing hydrogen gas during a reduction reaction.
5. The method of claim 4 , wherein the reducing agent is characterized as having a reducing rate that occurs more rapidly with an increase in pH.
6. The method of claim 1 , wherein the step of measuring the quantity of hydrogen comprises:
providing an expandable space at a substantially constant pressure;
directing hydrogen evolved from the sample into the expandable space;
measuring a change in the expandable space; and
determining the quantity of hydrogen based on the change in expandable space.
7. The method of claim 6 , wherein the expandable space is bounded by a container and a liquid at atmospheric pressure.
8. The method of claim 1 , wherein measuring the quantity of hydrogen, comprises:
providing a space of constant volume;
directing hydrogen evolved from the sample into the space of constant volume;
measuring a change in pressure in the space of constant volume; and
determining the quantity of hydrogen based on the change in pressure in the space of constant volume.
9. The method of claim 8 , wherein the space of constant volume is bounded by a container and the sample.
10. The method of claim 1 further comprising creating turbulence in the sample.
11. The method of claim 10 wherein creating turbulence comprises sonicating the sample.
12. The method of claim 1 , further comprising:
replacing part or all of the plating bath if the concentration of the reducing agent is not within the predetermined range.
13. The method of claim 1 , further comprising:
adding a quantity of reducing agent to the plating bath to obtain a modified plating bath if the concentration of the reducing agent is below a predetermined level; and
plating the top surface of the metal interconnect by immersing the device structure in the modified plating bath.
14. The method of claim 1 , wherein the step of plating the top surface is performed for a period of time based on the concentration of the reducing agent.
15. A method of making a semiconductor device, comprising:
providing a device structure having an active circuit region and a metal interconnect that is over and insulated from the active circuit region, wherein the metal interconnect has a top surface that is exposed;
providing a plating bath having one of morpholine borane or dimethylamineborane as a reducing agent;
obtaining a sample of the plating bath;
introducing potassium hydroxide into the sample to assist in driving a reduction reaction, involving the reducing agent, to completion;
measuring a quantity of hydrogen evolved from the reduction reaction to determine a concentration of the reducing agent present in the sample; and
plating the top surface of the metal interconnect by immersing the device structure in the plating bath if the concentration of the reducing agent is within a predetermined range.
16. The method of claim 15 , wherein the step of measuring the hydrogen comprises:
providing an expandable space at a constant pressure;
directing the hydrogen evolved from the sample into the expandable space; and
measuring a change in the expandable space to determine the concentration of the reducing agent.
17. The method of claim 15 , wherein the step of measuring the quantity of hydrogen, comprises:
providing a space of constant volume;
directing hydrogen evolved from the sample into the space of constant volume; and
measuring a change in pressure in the space of constant volume to determine the concentration of the reducing agent.
18. The method of claim 15 further comprising sonicating the sample.
19. The method of claim 15 , further comprising:
replacing the plating bath if the concentration of the reducing agent is not within the predetermined range.
20. The method of claim 15 , further comprising:
adding reducing agent to the plating bath to obtain a modified plating bath if the concentration of the reducing agent is below the predetermined range; and
plating the semiconductor device by immersing the device structure in the modified plating bath.
21. The method of claim 15 , wherein the step of plating the semiconductor device is performed for a period of time based on the concentration of the reducing agent.
22. A method of making a semiconductor device, comprising:
providing a device structure having an exposed surface of metal to be plated;
providing a plating bath having a reducing agent;
obtaining a sample of the plating bath;
increasing a pH of the sample;
measuring a quantity of hydrogen evolved from the sample;
using the quantity of hydrogen measured in the step of measuring to determine a concentration of the reducing agent present in the sample;
adding reducing agent to the plating bath to obtain a modified plating bath if the concentration of the reducing agent is below a predetermined level; and
plating the semiconductor device by immersing the device structure in the plating bath or modified plating bath if the concentration of the reducing agent is within a predetermined range.
23. The method of claim 22 , wherein the step of increasing the pH comprises adding potassium hydroxide to the sample.
24. The method of claim 22 , wherein the reducing agent comprises one of hypophosphite, morpholine borane, dimethylamineborine, borohydride or hydrazine.
25. The method of claim 22 , wherein the step of measuring the quantity of hydrogen comprises:
providing an expandable space at a constant pressure;
directing hydrogen evolved from the sample into the expandable space;
measuring a change in the expandable space; and
determining the quantity of hydrogen based on the change in expandable space.
26. The method of claim 22 , wherein the step of measuring the quantity of hydrogen, comprises:
providing a space of constant volume;
directing hydrogen evolved from the sample into the space of constant volume;
measuring a change in pressure in the space of constant volume; and
determining the quantity of hydrogen based on the change in pressure in the space of constant volume.
27. The method of claim 22 further comprising sonicating the sample.
28. The method of claim 22 , further comprising:
replacing all or part of the plating bath if the concentration of the reducing agent is not within the predetermined range.
29. The method of claim 22 , wherein the step of plating the device is performed for a period of time based on the concentration of the reducing agent.