Socket and/or adapter device, and an apparatus and process for loading a socket and/or adapter device with a corresponding semi-conductor component

1. A system for loading a semi-conductor component into a socket, the system comprising:

a socket comprising a moveable cover;

a semi-conductor component disposed on a tray and directly underneath a loading machine, the loading machine comprising a device for aligning the loading machine in relation to the socket, wherein the loading machine comprises a mechanism for opening the moveable cover while loading the semi-conductor component onto the socket; and

a precision alignment device comprising a recess and aligning features, wherein the recess positions the semi-conductor component on the loading machine when a bottom surface of the loading machine contacts a top surface of the precision alignment device, wherein the semi-conductor component is positioned on the loading machine by lowering the bottom surface of the loading machine to contact the top surface of the precision alignment device and releasing the vacuum on the bottom surface of the loading machine, and wherein the precision alignment device, the socket and the tray are separate and distinct units.

2. The system according to claim 1 , wherein the device for aligning the loading machine comprises an attachment provided on the loading machine, the attachment comprising a corresponding tapered section.

3. The system according to claim 2 , wherein the attachment comprises a conical section.

4. The system according to claim 1 , wherein the device for aligning the loading machine comprises a recess provided at the loading machine.

5. The system according to claim 1 , wherein the socket comprises an aligning feature, wherein the device for aligning the loading machine couples with the aligning feature, and wherein the socket comprises no additional tapered surfaces or guidance devices.

6. The system according to claim 1 , wherein the device for aligning the loading machine couples with the aligning features on the precision alignment device.

7. The system according to claim 1 , wherein the loading machine comprises a loader head supported by a floating bearing.

8. The system according to claim 7 , wherein the floating bearing allows free lateral motion of the loader head.

9. The system according to claim 7 , wherein the floating bearing allows the loader head to move freely in a lateral direction as the loader head approaches the socket, or as the loader head approaches the precision alignment device.

10. The system according to claim 1 , wherein:

the socket comprises a first aligning feature, wherein the device for aligning the loading machine couples with the first aligning feature; and

the precision alignment device comprises a second aligning feature, wherein the device for aligning the loading machine couples with the second aligning feature.

11. The system according to claim 10 , wherein the device for aligning the loading machine comprises a pin, and wherein the first and second aligning features comprise a hole.

12. The system according to claim 11 , wherein the pin comprises a conical tip.

13. The system according to claim 12 , wherein the loading machine comprises a loader head supported on a floating bearing, wherein the floating bearing allows for lateral motion of the loader head.

14. The system according to claim 13 , wherein the conical tip entering the hole guides a lateral position of the loading machine as the loader head approaches the socket or the precision alignment device.

15. The system according to claim 1 , wherein the loading machine automatically opens the moveable cover while loading the semi-conductor component into the socket.

16. A loading device comprising:

an alignment device for aligning an electronic component to a loader head, the loader head comprising a plurality of pins, and the alignment device comprising a first set of plurality of holes, wherein the electronic component becomes aligned with the loader head in relation to a corresponding position in a socket when the plurality of pins are disposed inside the first set of plurality of holes; and

a socket comprising a moveable cover; the socket further comprising a second set of plurality of holes and no additional tapered surfaces or guidance devices, and wherein the socket loads the electronic component correctly when the plurality of pins are disposed inside the second set of plurality of holes, and wherein the first set of plurality of holes and the second set of plurality of holes are identical.

17. The loading device according to claim 16 , wherein the alignment device comprises a recess disposed on a planar surface, wherein the recess positions the electronic component.

18. The loading device according to claim 17 , wherein the the plurality of pins comprise a tapered tip.

19. The loading device according to claim 17 , wherein the recess comprises edges which correspond to dimensions of the electronic component.

20. The loading device according to claim 17 , wherein the recess comprises tapered edges, wherein the tapered edges guide the electronic component into the recess when the alignment device couples with the loader head.

21. A system for or loading a semi-conductor component into a socket, the system comprising:

a socket comprising a moveable cover;

a semi-conductor component disposed on a tray and directly underneath a loading machine, the loading machine comprising a device for aligning the loading machine in relation to the socket, wherein the loading machine comprises a mechanism for opening the moveable cover while loading the semi-conductor component into the socket; and

a precision alignment device comprising a recess and aligning features, wherein the recess positions the semi-conductor component on the loading machine when lowering a bottom surface of the loading machine in direction of the precision alignment device and releasing a vacuum on the bottom surface of the loading machine, and wherein the precision alignment device, the socket and the tray are separate and distinct units.