Method of producing an electronic component
View Patent ↗An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.
1. A method of producing an electronic component having a semiconductor chip with a rear side and side border regions in which the rear side and the side border regions form outer package sides, the method which comprises:
providing a semiconductor wafer having a rear side and a plurality of semiconductor chips;
immediately before separating individual ones of the plurality of the semiconductor chips, applying a plastic coating having a thickness in a micrometer range to the rear side of the semiconductor wafer;
separating the individual ones of the plurality of the semiconductor chips to obtain separated semiconductor chips;
thermally treating the separated semiconductor chips to perform a function selected from the group consisting of softening the plastic coating and melting the plastic coating;
using the plastic coating on the rear side of one of the separated semiconductor chips to wet corner regions, edge regions, and side border regions of the one of the separated semiconductor chips; and
completing the one of the separated semiconductor chips to form a packaged electronic component in which the rear side and the side border regions of the one of the separated semiconductor chips form outer faces of a package.
2. The method according to claim 1 , which comprises using a printing technique to perform the step of applying the plastic coating to the semiconductor wafer.
3. The method according to claim 1 , which comprises using a screen printing technique to perform the step of applying the plastic coating to the semiconductor wafer.
4. The method according to claim 1 , which comprises using a spraying technique to perform the step of applying the plastic coating to the semiconductor wafer.
5. The method according to claim 1 , which comprises using a centrifuging technique to perform the step of applying the plastic coating to the semiconductor wafer.
6. The method according to claim 1 , which comprises using an immersion technique to perform the step of applying the plastic coating to the semiconductor wafer.
7. The method according to claim 1 , which comprises, during a thermal treatment step that is used to package the one of the separated semiconductor chips, performing the thermally treating step and performing the step of using the plastic coating on the rear side of the one of the separated semiconductor chips to wet the corner regions, the edge regions, and the side border regions of the one of the separated semiconductor chips.
8. The method according to claim 1 , which comprises:
providing separating joins for separating the plurality of the semiconductor chips; and
performing the step of applying the plastic coating by selectively applying the plastic coating to the rear side of the semiconductor wafer such that at least all of the separating joins are covered by a width of the plastic coating that corresponds to at least twice a width of the separating joins.
9. The method according to claim 8 , which comprises performing the step of selectively applying the plastic coating to the rear side of the semiconductor wafer by spraying plastic of the plastic coating through a mask.
10. The method according to claim 8 , which comprises using a printing technique to perform the step of applying the plastic coating to the semiconductor wafer.
11. The method according to claim 8 , which comprises using a screen printing technique to perform the step of applying the plastic coating to the semiconductor wafer.
12. The method according to claim 8 , which comprises using a spraying technique to perform the step of applying the plastic coating to the semiconductor wafer.
13. The method according to claim 8 , which comprises using a centrifuging technique to perform the step of applying the plastic coating to the semiconductor wafer.
14. The method according to claim 8 , which comprises using an immersion technique to perform the step of applying the plastic coating to the semiconductor wafer.
15. The method according to claim 8 , which comprises, during a thermal treatment step that is used to package the one of the separated semiconductor chips, performing the thermally treating step and performing the step of using the plastic coating on the rear side of the one of the separated semiconductor chips to wet the corner regions, the edge regions, and the side border regions of the one of the separated semiconductor chips.