Semiconductor device edge termination structure
View Patent ↗In one embodiment, an edge termination structure is formed in a semiconductor layer of a first conductivity type. The termination structure includes an isolation trench and a conductive layer in contact with the semiconductor layer. The semiconductor layer is formed over a semiconductor substrate of a second conductivity type. In a further embodiment, the isolation trench includes a plurality of shapes that comprise portions of the semiconductor layer.
1. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type having an edge portion;
a semiconductor layer of a second conductivity type formed overlying the semiconductor substrate so that the semiconductor layer and semiconductor substrate form a primary blocking junction for the device;
an active device formed in a portion of the semiconductor layer, wherein the active device comprises:
a first doped region of the second conductivity type;
a second doped region of the first conductivity type formed in the first doped region; and
a control electrode formed adjacent the first and second doped regions; and
an edge termination structure formed at the edge portion, wherein the edge termination structure comprises:
a third doped region of the second conductivity type formed in the semiconductor layer;
a first conductive layer coupled to the third doped region; and
an isolation trench formed in the semiconductor layer adjacent to the third doped region.
2. The device of claim 1 wherein the isolation trench includes a matrix of shapes that comprise portions of the semiconductor layer.
3. The device of claim 2 wherein the matrix of shapes includes a plurality of round pillars.
4. The device of claim 2 wherein the matrix of shapes includes a matrix of shapes where adjacent rows are offset.
5. The device of claim 1 further comprising a charge compensation region formed in the semiconductor layer adjacent the active device.
6. The device of claim 5 wherein the charge compensation region comprises:
a trench formed in the semiconductor layer;
a first semiconductor layer of the first conductivity type formed in the trench;
a first buffer layer formed over the first semiconductor layer; and
a second semiconductor layer of the second conductivity type formed over the first buffer layer.
7. The device of claim 5 further comprising a second conductive layer coupled to the charge compensation region.
8. The device of claim 7 wherein the first and second conductive layers are coupled together.
9. The device of claim 1 wherein the control electrode comprises a spacer gate structure.
10. The device of claim 9 further comprising a third conductive layer coupled to the spacer gate structure, wherein the second conductive layer is between the third conductive layer and the semiconductor layer, and wherein the second and third conductive layers are isolated from each other.
11. The device of claim 1 further comprising a contact layer coupled to the second doped region, wherein the contact layer is further coupled to the first conductive layer.
12. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type having an edge portion;
a semiconductor layer of a second conductivity type formed over the semiconductor substrate;
a first doped region of the second conductivity type formed in the semiconductor layer adjacent to the edge portion;
a first conductive layer coupled to the first doped region;
an isolation region formed in the semiconductor layer adjacent to the first doped region;
a charge compensation region formed in the semiconductor layer;
a second doped region of the second conductivity type formed in the semiconductor layer adjacent to the charge compensation region;
a third doped region of the first conductivity type formed in the second doped region; and
a control electrode formed adjacent to the second and third doped regions.
13. The device of claim 12 wherein the charge compensation region comprises:
a trench formed in the semiconductor layer;
a first semiconductor layer of the first conductivity type formed in the trench;
a first intrinsic layer formed over the first semiconductor layer; and
a second semiconductor layer of the second conductivity type formed over the first intrinsic layer.
14. The device of claim 12 further comprising a second conductive layer coupled to the charge compensation region.
15. The device of claim 14 further comprising a contact layer coupled to the third doped region, wherein the contact layer is further coupled to the first and second conductive layers.
16. The device of claim 1 further comprising a plurality of epitaxial semiconductor layers formed overlying surfaces of the isolation trench.
17. The device of claim 16 further comprising a fourth doped region of the first conductivity type formed between the isolation trench and the semiconductor substrate for reducing leakage current.
18. The device of claim 16 , wherein the plurality of epitaxial semiconductor layers includes at least one semiconductor layer of the first conductivity type and at least one semiconductor layer of the second conductivity type.
19. The device of claim 18 , wherein the plurality of epitaxial semiconductor layers includes a buffer layer between the at least one semiconductor layer of the first conductivity type and the at least one semiconductor layer of the second conductivity type.
20. The device of claim 16 further comprising a dielectric material formed overlying the plurality of epitaxial semiconductor layers.
21. The device of claim 20 , wherein the dielectric material includes an oxide layer formed overlying the plurality of epitaxial semiconductor layers and a spin-on glass layer formed overlying the oxide layer.
22. The device of claim 12 , wherein the isolation region comprises:
an isolation trench formed in the semiconductor layer;
a plurality of epitaxial semiconductor layers formed overlying surfaces of the isolation trench;
a dielectric layer formed overlying the plurality of epitaxial semiconductor layers; and
a fourth doped region of the first conductivity type formed between the isolation trench and the semiconductor substrate for reducing leakage current.
23. The device of claim 22 , wherein plurality of epitaxial semiconductor layers includes at least one semiconductor layer of the first conductivity type, at least one semiconductor layer of the second conductivity type, and a buffer layer between the at least one semiconductor layer of the first conductivity type and the at least one semiconductor layer of the second conductivity type.