IP Library Granted Patent US 7,390,703
Granted Patent B2
US 7,390,703 · App. 11/062,766 · Granted Jun 24, 2008

Method for through-plating field effect transistors with a self-assembled monolayer of an organic compound as gate dielectric

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Quick Facts
Patent No.
US 7,390,703
App. No.
11/062,766
Granted
Jun 24, 2008
Kind
B2
Abstract

A method for through-plating field effect transistors with a self-assembled monolayer of an organic compound as gate dielectric includes through-plating by patterning a gate electrode material, and bringing an organic compound having dielectric properties into contact with the contact hole material and the gate electrode material. A contact hole material and the gate electrode material are at least partially uncovered. The contact hole is material not identical to the gate electrode material. A self-assembled monolayer of the organic compound is formed above the gate electrode material. The method also includes depositing and patterning the source and drain contacts without removing the self-assembled monolayer of the organic compound, and depositing a semiconductor material.

Claims (20)

1. A method for through-plating field effect transistors, comprising:

patterning a gate electrode material in relation to a substrate to form a gate electrode at a first region of the substrate;

depositing a contact hole material at a second region of the substrate separated from the first region such that the gate electrode is spaced from the contact hole material after deposition of the contact hole material, wherein the contact hole material is different from the gate electrode material;

depositing an organic compound that is selective with respect to the gate electrode material in relation to the contact hole material so as to form a self-assembled monolayer that is located above the gate electrode material and that covers the gate electrode while leaving at least a portion of the contact hole material exposed, wherein the formed organic compound has dielectric properties;

depositing and patterning source and drain contacts proximate the gate electrode without removing the self-assembled monolayer of the organic compound; and

depositing a semiconductor material.

2. The method of claim 1 , wherein the gate electrode material is selected from the group consisting of Al, Ti, TiN, Ta, TaN, W, TiW, TaW, WN, WCN, IrO, RuO, and SrRuO, and the contact hole material is selected from the group consisting of gallium arsenide, indium phosphide, Au, Pt, Pd, and Ag.

3. The method of claim 1 , wherein the contact hole material is selected from the group consisting of Al, Ti, TiN, Ta, TaN, W, TiW, TaW, WN, WCN, IrO, RuO, and SrRuO, and the gate electrode material is selected from the group consisting of gallium arsenide, indium phosphide, Au, Pt, Pd, and Ag.

4. The method of claim 1 , wherein the gate electrode material includes a metal oxide layer at a surface of the gate electrode material.

5. The method of claim 1 , wherein the contact hole material includes a metal oxide layer at a surface of the contact hole material.

6. The method of claim 2 , wherein the organic compound comprises a phosphonic acid derivative.

7. The method of claim 2 , wherein the organic compound has the formula R-PO(OM) 2 , where R is one of an n-alkyl, n-alkyl ether, and a linear aromatic group of the formula -(C 6 H 4 )n-, where the n-alkyl and n-alkyl ether groups have between 4 and 20 C atoms, n is an integer between 2 and 6 and M is one of H, metal and an organic radical.

8. The method of claim 1 , wherein the semiconductor material is an organic polymer.

9. The method of claim 8 , wherein the organic polymer is selected from the group consisting of pentacene, tetracene, and polythiophene.

10. The method of claim 2 , wherein the gate electrode material includes a metal oxide layer at a surface of the gate electrode material.

11. The method of claim 3 , wherein the contact hole material includes a metal oxide layer at a surface of the contact hole material.

12. The method of claim 1 , wherein the organic compound includes a radical selected from the group consisting of R-SiCl 3 , R-SiCl 2 alkyl, R-SiCl(alkyl) 2 , R-Si(OR) 3 , R-Si(OR) 2 alkyl, R-SiOR(alkyl) 2 , R-PO(OH) 2 , R-CHO, R-CH═CH 2 , SH, OH, NH 2 , COOH, CONH 2 , CONHOH, CONHNH 2 , and CN, where R is one of an n-alkyl, n-alkyl ether and a linear aromatic group of the formula -(C 6 H 4 )n-, where the n-alkyl and n-alkyl ether groups have between 4 and 20 C atoms and n is an integer between 2 and 6.

13. The method of claim 3 , wherein the organic compound includes a radical selected from the group consisting of SH, OH, NH 2 , NHR, NR 2 , COOH, CONH 2 , CN, CONHOH, CONHNH 2 , and PR 2 , where R is one of an n-alkyl, n-alkyl ether and a linear aromatic group of the formula -(C 6 H 4 )n-, where the n-alkvl and n-alkvl ether groups have between 4 and 20 C atoms and n is an integer between 2 and 6.

14. The method of claim 4 , wherein the organic compound has the formula R-PO(OM) 2 , where R is one of an n-alkyl, n-alkyl ether and a linear aromatic group of the formula -(C 6 H 4 )n-, where the n-alkyl and n-alkyl ether groups have between 4 and 20 C atoms and n is an integer between 2 and 6 and M is one of H, metal, and an organic radical.

15. The method of claim 1 , wherein the organic compound comprises a polythiophene.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023853/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2005
From: KLAUK, HAGEN; HALIK, MARCUS; ZSCHIESCHANG, UTE; SCHMID, GUENTER; BRAUN, STEFAN
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016034/0093 →