Fabrication of organic electronic circuits by contact printing techniques
View Patent ↗A method for fabricating an organic conductor path on a substrate includes providing a printing stamp with a hydrophobic patterned printing side that is loaded with a printing medium containing an organic conductive polymer and, by bringing it into contact with a hydrophilic substrate, a patterned layer including the organic polymer are formed on the substrate. The method can be operated continuously through selection of suitable geometries for the printing stamp and the substrate.
1. A method for fabricating an organic conductor path on a substrate, comprising:
(a) providing a substrate;
(b) providing a printing stamp with a patterned printing side situated thereon, the patterned printing side including elevated sections and recessed sections arranged between the elevated sections that correspond to a structure to be imaged;
(c) loading of the patterned printing side with a printing medium containing at least one conductive organic polymer or a precursor thereof;
(d) removing any excess printing medium from the elevated sections of the patterned printing side such that the printing medium remains only in the recessed sections of the patterned printing side;
(e) mutually arranging and aligning the substrate and the patterned printing side of the printing stamp with respect to each other and bringing the patterned printing side into contact with the substrate; and
(f) removing the printing stamp from the substrate so as to transfer the printing medium situated in the patterned printing side onto the substrate;
wherein the patterned printing side includes a hydrophobic interface, the substrate includes a hydrophilic interface and the printing medium is hydrophilic.
2. The method of claim 1 , further comprising:
(g) upon transferring the printing medium to the substrate in step (f), baking the substrate to affix the printing medium to the substrate.
3. The method of claim 1 , wherein at least one of the patterned printing side and the printing stamp comprises a flexible material.
4. The method of claim 1 , wherein the substrate comprises a flexible material.
5. The method of claim 4 , wherein the patterned printing side is brought into contact with the substrate by pressing the flexible material of the substrate against the patterned printing side with a pressure roller.
6. The method of claim 1 , further comprising:
(g) repeating steps (a)-(f) a plurality of times to transfer a plurality of printing mediums to the substrate.
7. The method of claim 6 , wherein different printing sides are utilized in at least two series of repeating steps (a)-(f).
8. The method of claim 7 , wherein the conductor path formed on the substrate by repeating steps (a)-(f) comprises a field-effect transistor.
9. The method of claim 6 , wherein different printing mediums are utilized in at least two series of repeating steps (a)-(f).
10. The method of claim 1 , wherein the conductor path formed on the substrate comprises a microelectronic component.
11. The method of claim 9 , wherein the microelectronic component comprises a field-effect transistor.