Die down multi-media card and method of making same
View Patent ↗A circuit module comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Attached to the die pad is a semiconductor die which extends along a die plane disposed between and generally parallel to the frame planes. The semiconductor die is electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the die pad is exposed within a top surface defined by the body and the contacts are exposed within a bottom surface defined by the body.
1. A memory card comprising:
a leadframe having:
at least one die pad; and
a plurality of contacts;
the leadframe being configured such that the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
a semiconductor die attached to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes, the semiconductor die being electrically connected to the leadframe; and
a body at least partially encapsulating the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body.
2. The memory card of claim 1 wherein the leadframe further includes a plurality of conductive traces which extend from respective ones of the contacts toward the die pad.
3. The memory card of claim 2 wherein each of the traces defines a sloped portion extending between the die pad and the contacts.
4. The memory card of claim 2 wherein a plurality of conductive wires is used to, electrically connect the semiconductor die to respective ones of the traces.
5. The memory card of claim 4 wherein:
each of the traces includes a bond pad formed thereon; and
the conductive wires are used to electrically connect the semiconductor die to respective ones of the bond pads.
6. The memory card of claim 1 wherein:
the die pad defines opposed, generally planar top and bottom surfaces;
each of the contacts defines opposed, generally planar top and bottom surfaces;
the semiconductor die is attached to the bottom surface of the die pad; and
the bottom surfaces of the contacts are exposed in the bottom surface of the body.
7. The memory card of claim 1 wherein:
the package body defines a top surface having a recess formed therein; and
a label is attached to the package body and disposed within the recess.
8. The memory card of claim 1 wherein:
the package body defines a side surface; and
the contacts are disposed in spaced relation to the side surface.
9. A method of fabricating a memory card, comprising the steps of:
a) providing a leadframe having at least one die pad and a plurality of contacts wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes;
b) attaching a semiconductor die to the die pad such that the semiconductor die extends along a die plane which is disposed between and generally parallel to the frame planes;
c) electrically connecting the semiconductor die to the leadframe; and
d) partially encapsulating the leadframe and the semiconductor die with a body such that the contacts are exposed in a bottom surface defined by the body.
10. The method of claim 9 wherein step (a) comprises providing a leadframe wherein a plurality of conductive traces extends from respective ones of the contacts toward the die pad.
11. The method of claim 10 wherein step (a) comprises providing a leadframe wherein each of the traces is bent to define a sloped portion extending between the die pad and the contacts.
12. The method of claim 10 wherein step (c) comprises electrically connecting the semiconductor die to respective ones of the traces through the use of a plurality of conductive wires.
13. The method of claim 12 wherein:
step (a) comprises providing a leadframe wherein each of the traces includes a bond pad formed thereon; and
step (c) comprises electrically connecting the semiconductor die to respective ones of the bond pads through the use of the conductive wires.
14. The method of claim 9 wherein:
step (a) comprises providing a leadframe wherein the die pad defines opposed, generally planar top and bottom surfaces and each of the contacts defines opposed, generally planar top and bottom surfaces;
step (b) comprises attaching the semiconductor die to the bottom surface of the die pad; and
step (d) comprises forming the body such that the bottom surfaces of the contacts are exposed in the bottom surface thereof.
15. The method of claim 9 wherein:
step (a) comprises providing a leadframe wherein each of the contacts is connected to a dambar of the leadframe; and
step (d) comprises forming the body such that the dambar protrudes therefrom.
16. The method of claim 15 further comprising the step of:
e) removing the dambar from the leadframe to facilitate the electrical isolation of the contacts from each other.
17. The method of claim 9 wherein step (d) is completed through the implementation of a molding process selected from the group consisting of:
injection molding;
resin transfer molding;
infusion molding; and
reaction injection molding.
18. The method of claim 9 wherein step (d) comprises forming the body to have a form factor selected from the group consisting of:
a multi-media card form factor;
a secure digital card form factor; and
a compact flash card form factor.
19. The method of claim 9 wherein step (d) comprises forming the body such that the contacts are disposed in spaced relation to a side surface defined by the body.
20. The method of claim 9 wherein:
step (d) comprises forming the body to include a top surface having a recess formed therein; and
the method further comprises the step (e) of attaching a label to the body within the recess.