Liquid DIMM Cooler
A liquid cooled heat sink for electronic circuit boards is described. A heat sink base includes a liquid cooling arrangement to remove heat from the base. An arrangement of cooling fins extends from the base, and at least one surface of each fin includes a thermal interface layer. The arrangement is adapted so that the fins fit between parallel electronic circuit boards such that for each circuit board, a thermal contact layer of a fin contacts multiple components on the circuit board so as to conduct heat from the components into the fin, which in turn transfers heat to the heat sink base.
1 . A heat sink for electronic circuit boards, the heat sink comprising:
a heat sink base including a liquid cooling arrangement to remove heat from the base; and
an arrangement of cooling fins extending from the base, at least one surface of each fin including a thermal interface layer;
wherein the arrangement is adapted so that the fins fit between parallel electronic circuit boards such that for each circuit board, a thermal contact layer of a fin contacts a plurality of components on the circuit board so as to conduct heat from the components into the fin, which in turn transfers heat to the heat sink base.
2 . A heat sink according to claim 1 , wherein the cooling fins extend perpendicularly from the heat sink base.
3 . A heat sink according to claim 1 , wherein the heat sink base is made of aluminum.
4 . A heat sink according to claim 1 , wherein the heat sink base is made of copper.
5 . A heat sink according to claim 1 , wherein the cooling fins are made of aluminum.
6 . A heat sink according to claim 1 , wherein the cooling fins are made of copper.
7 . A heat sink according to claim 1 , wherein the electronic circuit boards are DIMM modules.
8 . A heat sink according to claim 1 , wherein the electronic circuit boards include at least one of a Voltage Regulator (VR) module, a graphics module, an input/output (I/O) module, or a PCI module.
9 . A heat sink according to claim 1 , wherein the thermal interface layer includes an outer layer of electrically isolating material.
10 . A heat sink according to claim 1 , further comprising:
securing hardware to mechanically attach the heat sink in place.
11 . A method of liquid cooling for electronic circuit boards, the method comprising:
providing a heat sink base including a liquid cooling arrangement to remove heat from the base; and
providing an arrangement of cooling fins extending from the base, at least one surface of each fin including a thermal interface layer;
wherein the arrangement is adapted so that the fins fit between parallel electronic circuit boards such that for each circuit board, a thermal contact layer of a fin contacts a plurality of components on the circuit board so as to conduct heat from the components into the fin, which in turn transfers heat to the method base.
12 . A method according to claim 11 , wherein the cooling fins extend perpendicularly from the method base.
13 . A method according to claim 11 , wherein the heat sink base is made of aluminum.
14 . A method according to claim 11 , wherein the heat sink base is made of copper.
15 . A method according to claim 11 wherein the cooling fins are made of aluminum.
16 . A method according to claim 11 wherein the cooling fins are made of copper.
17 . A method according to claim 11 , wherein the electronic circuit boards are DIMM modules.
18 . A method according to claim 11 , wherein the electronic circuit boards include at least one of a Voltage Regulator (VR) module, a graphics module, an input/output (I/O) module, or a PCI module.
19 . A method according to claim 11 , wherein the thermal interface layer includes an outer layer of electrically isolating material.
20 . A method according to claim 11 , further comprising:
providing securing hardware to mechanically attach the heat sink in place.