IP Library Granted Patent US 7,326,957
Granted Patent B2
US 7,326,957 · App. 11/134,512 · Granted Feb 5, 2008

Thin film field effect transistor with gate dielectric made of organic material and method for fabricating the same

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Quick Facts
Patent No.
US 7,326,957
App. No.
11/134,512
Granted
Feb 5, 2008
Kind
B2
Abstract

The gate dielectric layer of a thin film field effect transistor is formed as a multilayer layer system having at least one self assembling molecular monolayer (SAM) and a dielectric polymer layer made of an insulating polymer. With comparatively small layer thicknesses of 10 to 50 nanometers, the multilayer gate dielectric layer ensures low leakage currents and enables failsafe operation of the thin film field effect transistor at low supply voltages of less than 5 volts. The gate dielectric layer is robust toward voltages of up to approximately 20 volts and permits the use of a multiplicity of different materials for realizing an underlying electrode.

Claims (22)

1. A thin film field effect transistor, comprising:

a gate electrode, a source electrode, and a drain electrode, each electrode being made of electrically conductive material;

a semiconductor body of a semiconductor material arranged between the source electrode and the drain electrode, the semiconductor body including a charge carrier distribution disposed in a section of the semiconductor body controlled by a potential at the gate electrode; and

a gate dielectric layer with a molecular self assembling monolayer, the gate dielectric layer spacing the semiconductor body apart from the gate electrode,

wherein the gate dielectric layer is reinforced by at least a dielectric polymer layer made of an electrically insulating polymer.

2. The thin film field effect transistor as claimed in claim 1 , wherein the thickness of the dielectric polymer layer is at least 5 nanometers.

3. The thin film field effect transistor as claimed in claim 2 , wherein the dielectric polymer layer has a thickness in the range between 10 and 50 nanometers.

4. The thin film field effect transistor as claimed in claim 1 , wherein the dielectric polymer is cross-linked.

5. The thin film field effect transistor as claimed in claim 1 , wherein the dielectric polymer is poly-4-vinylphenol, a copolymer thereof, or polystyrene.

6. The thin film field effect transistor as claimed in claim 1 , wherein the dielectric polymer layer is provided between the semiconductor body and the self assembling molecular monolayer.

7. The thin film field effect transistor as claimed in claim 1 , wherein the material of the monolayer is a compound of the general formula R 1 Si(R 2 ) 3 , where R 1 is an alkyl group having 10 to 30 carbon atoms which may be substituted by one or more heteroatoms or aryl groups, and R 2 is a halogen or an alkoxy group derived from an alcohol having 1 to 4 carbon atoms.

8. The thin film field effect transistor as claimed in claim 1 , wherein the semiconductor body is made of an organic semiconductor material.

9. The thin film field effect transistor as claimed in claim 8 , wherein the organic semiconductor material is pentacene.

10. The thin film field effect transistor as claimed in claim 1 , wherein the semiconductor body is made of an inorganic semiconductor material.

11. The thin film field effect transistor as claimed in claim 1 , wherein the thin film field effect transistor is arranged on glass or a flexible film as a carrier substrate.

12. A thin film field effect transistor, comprising:

a gate electrode, a source electrode, and a drain electrode, each electrode being made of electrically conductive material;

a semiconductor body of a semiconductor material arranged between the source electrode and the drain electrode, the semiconductor body including a charge carrier distribution disposed in a section of the semiconductor body controlled by a potential at the gate electrode; and

a gate dielectric layer with a molecular self assembling monolayer, the gate dielectric layer spacing the semiconductor body apart from the gate electrode, the monolayer being arranged on the gate electrode, the gate dielectric layer being reinforced by a dielectric polymer layer made of an electrically insulating polymer,

wherein the thickness of the dielectric polymer layer is at least 5 nanometers.

13. The thin film field effect transistor as claimed in claim 12 , wherein the dielectric polymer layer is applied from an organic solvent.

14. The thin film field effect transistor as claimed in claim 12 , wherein the dielectric polymer layer is cross-linked.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023853/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2005
From: HALIK, MARCUS; KLAUK, HAGEN; ZSCHIESCHANG, UTE; SCHMID, GUNTER
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016273/0404 →