Granted Patent B1

US 7,256,141 · App. 11/135,492 · Granted Aug 14, 2007

Abstract

Claims (30)

1. A method, comprising:

forming a first layer of polycrystalline silicon;

cleaning a surface of the first layer;

forming an interface layer over the surface of the first layer, wherein the interface layer comprises one of titanium, cobalt, or nickel;

forming a second layer of polycrystalline silicon over the interface layer; and

thermal cycling the first layer, interface layer and second layer to form at least one of titanium silicide, cobalt silicide or nickel silicide between at least a portion of the interface layer and portions of the first and second layers.

2. The method of claim 1 , wherein thermal cycling the first layer, interface layer and second layer further comprises:

thermal cycling the first layer, interface layer and second layer to form the at least one of titanium silicide, cobalt silicide and nickel silicide to a thickness ranging from about 50 Å to about 1,000 Å.

3. The method of claim 1 , wherein forming an interface layer comprising:

forming the interface layer to a thickness ranging from about 10 Å to about 500 Å.

4. The method of claim 1 , wherein forming the interface layer comprises:

depositing the titanium, cobalt or nickel over the surface of the first layer.

5. A method of forming an interface between dual polycrystalline silicon layers, comprising:

forming a first layer of polycrystalline silicon;

forming a metal interface layer on the first layer of polycrystalline silicon, wherein the metal interface layer comprises at least one of titanium (Ti), cobalt (Co) or nickel (Ni); and

forming a second layer of polycrystalline silicon on the metal interface layer; and

thermal cycling the first layer, metal interface layer and second layer to form at least one of titanium silicide (TiSi), cobalt silicide (CoSi) or nickel silicide (NiSi) between at least a portion of the metal interface layer and portions of the first and second layers.

6. The method of claim 5 , wherein forming a metal interface layer comprises:

forming the metal interface layer to a thickness ranging from about 10 Å to about 500 Å.

7. The method of claim 5 , wherein forming the metal interface layer comprises:

depositing the titanium, cobalt or nickel over the first layer.

8. The method of claim 5 , further comprising:

cleaning a surface of the first layer prior to forming the interface layer on the first layer.

9. A method, comprising:

forming a first layer of polycrystalline silicon;

forming a metal interface layer on the first layer of polycrystalline silicon;

forming a second layer of polycrystalline silicon on the metal interface layer; and

thermal cycling the first layer, metal interface layer and second layer to form a metal silicide between at least a portion of the metal interface layer and portions of the first and second layers.

10. The method of claim 9 , wherein the metal interface layer comprises a metal, a metal alloy, or a combination of metals or metal alloys.

11. The method of claim 10 , wherein the metal interface layer comprises at least one of titanium (Ti), cobalt (Co) or nickel (Ni).

Assignments (8)