IP Library Granted Patent US 7,465,351
Granted Patent B2
US 7,465,351 · App. 11/155,104 · Granted Dec 16, 2008

Melter assembly and method for charging a crystal forming apparatus with molten source material

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Quick Facts
Patent No.
US 7,465,351
App. No.
11/155,104
Granted
Dec 16, 2008
Kind
B2
Abstract

A method of servicing multiple crystal forming apparatus with a single melter assembly is provided. The method includes the steps of positioning the melter assembly relative to a first crystal forming apparatus for delivering molten silicon to a crucible of the first apparatus. A heater in the melter assembly is operated to melt source material in a melting crucible. A stream of molten source material is delivered from the melter assembly to the first crystal forming apparatus. The melter assembly is positioned relative to a second crystal forming apparatus for delivering molten silicon to a crucible of the second apparatus. A stream of molten source material is transferred from the melter assembly to the second crystal forming apparatus.

Claims (20)

1. A method of servicing multiple crystal forming apparatus with a single melter assembly, the method comprising the steps of:

positioning the melter assembly above a first crystal forming apparatus for delivering molten silicon to a crucible of the first apparatus;

operating a heater in the melter assembly to melt source material in a melting crucible of the melter assembly;

delivering a stream of molten source material from the melter assembly to the first crystal forming apparatus;

moving the melter assembly to a position above a second crystal forming apparatus for delivering molten silicon to a crucible of the second apparatus;

delivering a stream of molten source material from the melter assembly to the second crystal forming apparatus.

2. A method as set forth in claim 1 wherein operating a heater in the melter assembly to melt source material comprises providing electrical power to an upper induction coil of the heater.

3. A method as set forth in claim 1 wherein delivering a stream of molten source material comprises providing electrical power to a lower induction coil of the heater to initiate flow through an orifice of the melter assembly.

4. A method as set forth in claim 1 further comprising discontinuing the flow of molten source material from the melting crucible by discontinuing the operation of the heater.

5. A method as set forth in claim 4 wherein the step of discontinuing the flow of molten source material comprises forming a solid plug of source material preventing flow from the melting crucible.

6. A method as set forth in claim 1 further comprising growing a monocrystalline ingot from the source material delivered to at least one of said first crystal forming apparatus and said second crystal forming apparatus.

7. A method as set forth in claim 1 further comprising forming a polycrystalline body from the source material delivered to at least one of said first crystal forming apparatus and said second crystal forming apparatus.

8. A method as set forth in claim 7 wherein said polycrystalline body comprises a hollow polygonal silicon body formed by an Edge-defined Film Growth method.

9. A method as set forth in claim 7 wherein said polycrystalline body comprises a ribbon of polycrystalline silicon.

10. A method as set forth in claim 7 wherein said polycrystalline body comprises a cast silicon body.

11. A method as set forth in claim 1 wherein said moving the melter assembly to a position above the second crystal forming apparatus comprises lifting the melter assembly.

12. A method as set forth in claim 1 further comprising connecting the melter assembly to a lower housing of the second crystal forming apparatus prior to delivering a stream of molten source material to the second crystal forming apparatus.

13. A method as set forth in claim 1 wherein operation of an upper induction coil to melt source material in the melting crucible further comprises forming an unmelted plug of solid source material in the nozzle at the bottom of the melting crucible.

14. A method as set forth in claim 1 wherein delivering the stream of molten source material to the first crystal forming apparatus comprises delivering the stream of molten source material to the first crystal forming apparatus at a flow rate of between about 50 kg/hr and about 140 kg/hr.

15. A method as set forth in claim 1 wherein delivering the stream of molten source material to the second crystal forming apparatus comprises delivering the stream of molten source material to the second crystal forming apparatus at a flow rate of between about 50 kg/hr and about 140 kg/hr.

Assignments (11)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →
NOTICE OF LICENSE AGREEMENT Recorded Jun 6, 2014
From: SUNEDISON SEMICONDUCTOR LIMITED
To: SUNEDISON SEMICONDUCTOR TECHNOLOGY PTE. LTD.
Reel/Frame 033099/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
SECURITY AGREEMENT Recorded Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
SECURITY AGREEMENT Recorded Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE NAME IS SHOWN AS MEMC MATERIALS, INC. WHEREAS THE CORRECT INFORMATION IS MEMC ELECTRONIC MATERIALS, INC. PREVIOUSLY RECORDED ON REEL 016706 FRAME 0546. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Nov 30, 2005
From: HOLDER, JOHN DAVIS
To: MEMC ELECTRONIC MATERIALS, INC.
Reel/Frame 016833/0100 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2005
From: HOLDER, JOHN DAVIS
To: MEMC MATERIALS, INC.
Reel/Frame 016706/0546 →