Chemical die singulation technique
View Patent ↗A method is provided for manufacturing a semiconductor device from a substrate ( 200 ) having an active surface ( 204 ) and a non-active surface ( 206 ). The method comprises depositing a backing material ( 104 ) onto the non-active surface of the substrate ( 206 ) in a pattern ( 500 ), the pattern ( 500 ) having at least a first die section ( 210 ), a second die section ( 212 ) adjacent the first die section ( 210 ), and a strip ( 216 ) connecting the first die section ( 210 ) and the second die section ( 212 ), removing material from portions of the non-active surface of the substrate ( 206 ) on which the backing material ( 104 ) is not deposited to thereby partially separate the substrate ( 200 ) into a first die ( 236 ) and a second die ( 238 ) connected to one another by the strip ( 254 ) of the deposited backing material, and breaking the strip connector ( 254 ) to separate the first die ( 236 ) from the second die ( 238 ).
1. A method for manufacturing a semiconductor device from a substrate having an active surface and a non-active surface, the method comprising:
depositing a backing material onto the non-active surface of the substrate in a pattern, the pattern having at least a first die section, a second die section adjacent the first die section, and a strip connecting the first die section and the second die section;
removing material from portions of the non-active surface of the substrate on which the backing material is not deposited to thereby partially separate the substrate into a first die and a second die connected to one another by the strip of the deposited backing material; and
breaking the strip connector to separate the first die from the second die.
2. The method of claim 1 , wherein the step of depositing comprises:
placing a shadow mask having an outline of the pattern formed therein over the non-active surface of the substrate; and
depositing the backing material over the shadow mask and the non-active surface of the substrate to thereby form the pattern on the substrate.
3. The method of claim 1 , wherein the step of depositing comprises depositing a metal.
4. The method of claim 1 , wherein the step of depositing comprises depositing a non-metal.
5. The method of claim 1 , wherein the step of depositing comprises:
depositing the backing material over the non-active surface of the substrate;
depositing photoresist in the pattern over the deposited backing material, wherein at least a portion of the deposited backing material is exposed; and etching the exposed backing material.
6. The method of claim 1 , wherein the first die section is circular.
7. The method of claim 1 , wherein the first die section is polygonal having corners that are rounded or sharp.
8. The method of claim 1 , further comprising: bonding a handle wafer to the active surface of the substrate.
9. The method of claim 8 , further comprising: reducing a thickness of the substrate, after the step of bonding the active surface of the substrate to a handle wafer.
10. The method of claim 9 , further comprising:
removing the substrate from the handle wafer; and
coupling the substrate to adhesive tape after the step of removing.
11. The method of claim 1 , further comprising:
coupling the substrate to adhesive tape, after the step of removing material from portions of the non-active surface of the substrate on which the backing material is not deposited.
12. The method of claim 1 , wherein the step of removing material from portions of the non-active surface of the substrate on which the backing material is not deposited comprises etching the substrate.
13. The method of claim 12 , wherein the step of etching the substrate comprises using a dry etching process on the substrate.
14. The method of claim 12 , wherein the step of etching the substrate comprises using a wet etching process on the substrate.
15. The method of claim 1 , wherein the step of breaking the strip connector comprises sawing the strip connector.
16. A method for manufacturing a die from a substrate, the method comprising:
bonding a handle wafer to an active surface of the substrate;
reducing a thickness of a non-active surface of the substrate;
depositing a backing material in a pattern onto the non-active surface of the substrate, the pattern having at least a first die section, a second die section adjacent the first die section, and a strip connecting the first die section to the second die section;
chemically removing a portion of the non-active surface of the substrate on which backing material is not deposited to partially separate the substrate into a first die and a second die connected to one another by the strip of the deposited backing material;
removing the handle wafer from the substrate;
coupling the deposited backing material to adhesive tape; and
breaking the strip to detach the first die from the second die.
17. The method of claim 16 , wherein the step of chemically removing includes the step of etching the exposed portion of the substrate.
18. The method of claim 16 , wherein the first die section is circular.
19. The method of claim 16 , wherein the first die section is polygonal having corners that are rounded or sharp.