Method of forming a charge-trapping memory device
View Patent ↗In a charge-trapping device having an array of memory cells, which are controlled by word lines buried in trenches within a substrate, further trenches are formed parallel to said word lines within said substrate. These subdivide diffusion regions adjacent to the word lines into each a first diffusion region adjacent to a first trench of a first charge-trapping memory cell and a second diffusion region adjacent to a first trench of a second charge-trapping memory cell. The depth of the further trench is sufficient to impede hot charge carrier exchange between neighboring memory cells. For this purpose the further trenches are filled with dielectric material, e.g., an oxide. The depth of the further trenches may be, e.g., half of that of the word line trench, and the width may, e.g., amount to 15-20 nm.
1. A method of forming a charge-trapping memory device having an array of memory cells, the method comprising:
providing a semiconductor substrate with a main surface;
forming first trenches within said semiconductor substrate, said first trenches having sidewalls;
doping said sidewalls to form U-shaped channel regions;
depositing a sequence of dielectric layers over the sidewalls of said first trenches, said sequence of dielectric layers comprising a bottom confinement layer, a memory layer and a top confinement layer;
filling said first trenches with a conductive material that overlies said sequence of dielectric layers to form gate electrodes and word lines;
doping said main surface adjacent to said first trenches to form diffusion regions, said diffusion regions serving as sources/drains of each of said memory cells;
forming second trenches parallel to said first trenches, said second trenches formed within said semiconductor substrate thereby subdividing each of said diffusion regions into a first diffusion region adjacent to one of said first trenches of a first charge-trapping memory cell and a second diffusion region adjacent to another one of said first trenches of a second charge-trapping memory cell;
filling said second trenches with dielectric material; and
performing an implantation after forming of said second trenches and prior to filling said second trenches in order to form a buried channel stop between said U-shaped channel regions of said charge-trapping memory cells for avoiding leakage currents from channel to channel.
2. The method according to claim 1 , wherein dielectric material used for depositing said top confinement layer and said bottom confinement layer is an oxide.
3. The method according to claim 1 , wherein said top confinement layer is deposited with a thickness of more than 10 nm and less than 70 nm.
4. The method according to claim 1 , wherein said bottom confinement layer is deposited with a thickness of more than 5 nm and less than 20 nm.
5. The method according to claim 1 , wherein dielectric material used for depositing said memory layer is a nitride.
6. The method according to claim 1 , wherein said memory layer is deposited with a thickness of more than 4 nm and less than 10 nm.
7. The method according to claim 1 , wherein filling said second trenches comprises filling said second trenches with an oxide.
8. The method according to claim 7 , wherein filling said second trenches comprises filling said second trenches with BPSG.
9. The method according to claim 7 , wherein filling said second trenches comprises filling said second trenches with EDP oxide.
10. The method according to claim 1 , wherein filling said second trenches with said dielectric material includes forming air-filled voids within said dielectric material filling said second trenches.
11. The method according to claim 1 , wherein forming said first trenches comprises:
providing a masking layer over said main surface of said semiconductor substrate, said masking layer provided with trench openings; and
etching said semiconductor substrate within said trench openings to form said first trenches;
wherein filling said first trenches comprises filling said first trenches with said conductive material and planarizing the surface;
and wherein forming said second trenches comprises removing said masking layer to expose said semiconductor substrate and to form trench top portions with said dieletric material protruding from said main surface of said semiconductor substrate;
forming spacers at said trench top portions with said dielectric material protruding from said main surface of said semiconductor substrate; and
using said spacers as an etch mask when performing the step of forming said second trenches.
12. The method according to claim 11 , wherein said conductive material is recessed within said trench top portions, and said trench top portions are then filled with another dielectric material.
13. The method according to claim 1 , wherein forming said second trenches comprises forming said second trenches having a depth of more than 20 nm.
14. The method according to claim 1 , wherein forming said second trenches comprises forming said second trenches having a width of more than 10 nm.
15. The method according to claim 1 , wherein forming said second trenches comprises forming said second trenches having a width of less than about 20 nm.
16. The method according to claim 1 , wherein forming said second trenches comprises forming said second trenches having a depth of less than about 50 nm.
17. A method of forming a charge-trapping memory device having an array of memory cells, the method comprising:
providing a semiconductor substrate with a main surface;
forming first trenches within said semiconductor substrate, said first trenches having sidewalls;
doping said sidewalls to form channel regions;
depositing a sequence of dielectric layers on said sidewalls of said first trenches, said sequence of said dielectric layers comprising a bottom confinement layer, a memory layer and a top confinement layer;
filling said first trenches with a conductive material that overlies said sequence of said dielectric layers to form gate electrodes and word lines;
doping the main surface adjacent to said first trenches to form diffusion regions, said diffusion regions serving as sources/drains of each of said memory cells;
forming second trenches parallel to said first trenches, said second trenches formed within said semiconductor substrate by means of etching, thereby subdividing each of said diffusion regions into a first diffusion region adjacent to one of said first trenches of a first charge-trapping memory cell and a second diffusion region adjacent to another one of said first trenches of a second charge-trapping memory cell;
performing an implantation after forming said second trenches and prior to filling said second trenches in order to form a buried channel stop between said channel regions of said charge-trapping memory cells for avoiding leakage currents from channel to channel;
filling said second trenches with dielectric material in order to impede hot charge carrier exchange between adjacent charge-trapping memory cells and planarizing said dielectric material; and
forming bit line contacts, which simultaneously contact the first and second diffusion regions.