IP Library Granted Patent US 7,262,630
Granted Patent B1
US 7,262,630 · App. 11/194,356 · Granted Aug 28, 2007

Programmable termination for single-ended and differential schemes

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Quick Facts
Patent No.
US 7,262,630
App. No.
11/194,356
Granted
Aug 28, 2007
Kind
B1
Abstract

In one embodiment of the invention, a programmable termination structure has first and second termination circuits for corresponding pads and a programmable connection therebetween. The first termination circuit supports first and second sets of termination schemes. A shared resistor is part of at least one termination scheme in each set. The first termination circuit supports a termination scheme between the first pad and a user-defined node connected to an on-chip capacitor such that first pad is connected via the termination scheme to the on-chip capacitor. Control circuitry automatically turns on and off a termination scheme for bidirectional signaling supported by the first termination circuit, wherein (1) the control circuitry turns off the termination scheme if an output buffer is configured to present outgoing signals at the first pad and (2) the control circuitry turns on the termination scheme if the output buffer is disabled in order to terminate incoming signals received at the first pad.

Claims (98)

1. An integrated circuit having a programmable termination structure for a first pad and a second pad, the termination structure comprising:

a first termination circuit associated with the first pad;

a second termination circuit associated with the second pad;

a programmable connection between the first and second termination circuits, wherein:

the first termination circuit is adapted to support first and second sets of termination schemes;

the first set of termination schemes comprises one or more of:

at least one single-ended non-thevenin pull-up termination between the first pad and a reference power voltage;

at least one single-ended non-thevenin pull-down termination between the first pad and a reference ground node; and

at least one single-ended thevenin termination between the first pad and (i) the reference power node and (ii) the reference ground node;

the second set of termination schemes comprises one or more of:

at least one single-ended non-thevenin user-defined termination between the first pad and a user-defined node;

at least one single-ended thevenin termination between the first pad and (i) the user-defined node and (ii) at least one of the reference power node and the reference ground node; and

at least one differential termination between the first and second pads; and

the first termination circuit comprises a shared resistor that is part of at least one termination scheme in the first set and at least one termination scheme in the second set.

2. The invention of claim 1 , wherein the shared resistor is a programmable resistor.

3. The invention of claim 1 , wherein:

the first set of termination schemes comprises each of:

at least one single-ended non-thevenin pull-up termination between the first pad and the reference power voltage;

at least one single-ended non-thevenin pull-down termination between the first pad and the reference ground node; and

at least one single-ended thevenin termination between the first pad and (i) the reference power node and (ii) the reference ground node; and

the second set of termination schemes comprises each of:

at least one single-ended non-thevenin user-defined termination between the first pad and the user-defined node;

at least one single-ended thevenin termination between the first pad and (i) the user-defined node and (ii) at least one of the reference power node and the reference ground node; and

at least one differential termination between the first and second pads.

4. The invention of claim 3 , wherein the shared resistor is part of:

at least one single-ended non-thevenin pull-up termination between the first pad and the reference power voltage;

at least one single-ended non-thevenin pull-down termination between the first pad and the reference ground node;

at least one single-ended thevenin termination between the first pad and (i) the reference power node and (ii) the reference ground node;

at least one single-ended non-thevenin user-defined termination between the first pad and the user-defined node;

at least one single-ended thevenin termination between the first pad and (i) the user-defined node and (ii) at least one of the reference power node and the reference ground node; and

at least one differential termination between the first and second pads.

5. The invention of claim 1 , wherein the shared resistor is part of a termination scheme of the first set between the first pad and an other node in which the total resistance between the first pad and the other node comprises the shared resistor and an other resistor, where the other resistor is not part of at least one termination scheme of the second set.

6. The invention of claim 1 , wherein the shared resistor is part of a termination scheme of the second set between the first pad and an other node in which the total resistance between the first pad and the other node comprises the shared resistor and an other resistor, where the other resistor is not part of at least one termination scheme of the first set.

7. The invention of claim 1 , wherein:

a first other programmable resistor is connected between the shared programmable resistor and the reference power node;

a second other programmable resistor is connected between the shared programmable resistor and the reference ground node; and

a third other programmable resistor is connected between the shared programmable resistor and both the second pad and the user-defined node.

8. The invention of claim 1 , wherein the termination structure comprises an on-chip capacitor connected to the user-defined node.

9. The invention of claim 8 , wherein the on-chip capacitor is a programmable capacitor.

10. The invention of claim 8 , wherein the user-defined node is adapted to be connected to an external capacitor.

11. The invention of claim 1 , wherein the termination structure is adapted to support bidirectional signaling at the first pad, wherein:

the termination structure comprises control circuitry adapted to automatically turn on and off a termination scheme for the bidirectional signaling, wherein:

the control circuitry is adapted to turn off the termination scheme if an output buffer of the integrated circuit is configured to present outgoing signals at the first pad;

the control circuitry is adapted to turn on the termination scheme if the output buffer is disabled in order to terminate incoming signals received at the first pad.

12. The invention of claim 1 , wherein the first termination circuit comprises:

a first programmable resistor connected between the reference power node and a first node;

a second programmable resistor connected between the first node and the reference ground node;

a third programmable resistor connected between the first node and the first pad;

a fourth programmable resistor connected between the first node and a second node; and

a fifth programmable resistor connected between the second node and a third node; and

the programmable connection is a programmable resistor connected between the second node and the second termination circuit.

13. The invention of claim 12 , wherein:

each of the first, second, third, fourth, and fifth programmable resistors comprises a plurality of active, transistor-type devices connected in parallel; and

the programmable connection comprises at least one active, transistor-type device.

14. The invention of claim 12 , further comprising an on-chip capacitor connected between the third node and the reference ground node.

15. The invention of claim 12 , wherein:

each of the first, second, and fourth programmable resistors is PVT controlled; and

each of the third and fifth programmable resistors and the programmable connection is not PVT controlled.

16. The invention of claim 1 , wherein the first termination circuit comprises a plurality of independently controllable sets of termination circuitry connected in parallel.

17. The invention of claim 16 , wherein each set of termination circuitry comprises:

a p-type transistor connected between the reference power node and a first node;

an n-type transistor connected between the first node and the reference ground node;

a first transmission gate connected between the first node and the first pad; and

a second transmission gate connected between the first node and a second node.

18. The invention of claim 17 , wherein:

a first set of termination circuitry further comprises an additional programmable pull-up resistor connected between the reference power node and the first pad; and

a last group of termination circuitry further comprises an additional programmable pull-down resistor connected between the reference ground node and the first pad.

19. The invention of claim 1 , wherein the integrated circuit is an FPGA.

20. An integrated circuit having a programmable termination structure for a first pad, the termination structure comprising a first termination circuit associated with the first pad, wherein:

the first termination circuit is adapted to support at least one termination scheme between the first pad and a user-defined node, wherein the user-defined node is an input/output (I/O) pad of the integrated circuit at which a user may apply an incoming signal or receive an outgoing signal; and

the termination structure comprises an on-chip capacitor connected to the user-defined node such that first pad is connected via the at least one termination scheme to the on-chip capacitor.

21. The invention of claim 20 , wherein the on-chip capacitor is connected between the user-defined node and a reference ground node.

22. The invention of claim 20 , wherein the on-chip capacitor is a programmable capacitor.

23. The invention of claim 20 , wherein the user-defined node is adapted to be connected to an external capacitor.

24. The invention of claim 20 , wherein the termination structure further comprises:

a second termination circuit associated with a second pad;

a programmable connection between the first and second termination circuits, wherein

the second termination circuit is adapted to support at least one termination scheme between the second pad and the user-defined node such that the second pad is connected via the at least one termination scheme to the on-chip capacitor.

25. The invention of claim 24 , wherein the first and second termination circuits are adapted to support a differential termination scheme between the first and second pads via the user-defined node such that the first and second pads are both connected via the differential termination scheme to the on-chip capacitor.

26. The invention of claim 20 , wherein the first termination circuit is adapted to support:

at least one single-ended non-thevenin user-defined termination between the first pad and the user-defined node;

at least one single-ended thevenin termination between the first pad and (i) the user-defined node and (ii) at least one of the reference power node and the reference ground node; and

at least one differential termination between the first pad and a second pad via the user-defined node.

27. An integrated circuit having a programmable termination structure for a first pad, the termination structure comprising a first termination circuit associated with the first pad, wherein:

the first termination circuit is adapted to support bidirectional signaling at the first pad;

the integrated circuit comprises control circuitry adapted to automatically turn on and off a termination scheme for the bidirectional signaling, wherein:

the control circuitry is adapted to turn off the termination scheme if an output buffer of the integrated circuit is configured to present outgoing signals at the first pad;

the control circuitry is adapted to turn on the termination scheme if the output buffer is disabled in order to terminate incoming signals received at the first pad; and

the control signal is based on an on-chip tri-state control signal also used to control the output buffer.

28. The invention of claim 27 , wherein the output buffer comprises one or more programmable resistors that are also part of one or more programmable termination schemes supported by the first termination circuit.

29. The invention of claim 28 , wherein the output buffer comprises:

a first programmable resistor connected between a reference power node and a first node;

a second programmable resistor connected between the first node and a reference ground node; and

a third programmable resistor connected between the first node and the first pad, wherein the third programmable resistor forms part of the termination scheme for the bidirectional signaling.

30. The invention of claim 28 , wherein:

each programmable resistor is adapted to be configured on and off;

if configured off, the programmable resistor provides effectively infinite resistance; and

if configured on, the programmable resistor provides a resistance configurably selected from a set of one or more available resistance levels.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded May 21, 2019
From: JEFFERIES FINANCE LLC
To: LATTICE SEMICONDUCTOR CORPORATION; SILICON IMAGE, INC.; SIBEAM, INC.; DVDO, INC.
Reel/Frame 049827/0326 →
SECURITY INTEREST Recorded May 21, 2019
From: LATTICE SEMICONDUCTOR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 049980/0786 →
SECURITY INTEREST Recorded Mar 18, 2015
From: LATTICE SEMICONDUCTOR CORPORATION; SIBEAM, INC.; SILICON IMAGE, INC.; DVDO, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 035223/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2005
From: ANDREWS, WILLIAM B.; BRITTON, BARRY K.; SCHADT, JOHN; LIN, MOU C.
To: LATTICE SEMICONDUCTOR CORPORATION
Reel/Frame 016643/0846 →