IP Library Granted Patent US 8,598,716
Granted Patent B2
US 8,598,716 · App. 11/210,723 · Granted Dec 3, 2013

Semiconductor apparatus having stacked semiconductor components

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Quick Facts
Patent No.
US 8,598,716
App. No.
11/210,723
Granted
Dec 3, 2013
Kind
B2
Abstract

The present invention provides an apparatus having stacked semiconductor components. Two semiconductor components ( 21, 26 ) are arranged such that their contact regions ( 28, 22 ) are opposite one another. A contact-connection device ( 29 ) forms a short electrical connection between the two contact regions ( 28, 22 ). The contact regions ( 28, 22 ) are connected to external contact regions ( 36 ) of the apparatus via a rewiring ( 23 ).

Claims (8)

1. Semiconductor apparatus, comprising:

stacked semiconductor components with:

a first semiconductor component with a first contact region, and

a second semiconductor component with a second contact region being arranged in such a manner that the first contact region and the second contact region are opposite one another, wherein the first semiconductor component is embedded in a first potting compound and the second semiconductor component is embedded in a second potting compound, and

a contact-connection device conductively connecting the first contact region to the second contact region, and the contact-connection device being connected to an external contact-connection region on an outer surface of the second potting compound by means of a first rewiring and a second rewiring, the first rewiring being situated directly between the two contact regions and the second rewiring contact-connecting the external contact-connection region and contact-connecting a region of the first rewiring not covered by the second potting compound, provision being made of at least one earth surface that runs parallel to the rewiring, and

a dielectric layer being introduced between the rewiring and the earth surface in order to match the impedance of the rewiring.

2. Semiconductor apparatus according to claim 1 , the first potting compound or the second potting compound containing a polymer.

3. Semiconductor apparatus according to claim 1 , the contact-connection device having conductive adhesive and/or solder deposits and/or being produced using diffusion soldering.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2015
From: INFINEON TECHNOLOGIES AG
To: POLARIS INNOVATIONS LIMITED
Reel/Frame 036888/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2005
From: HEDLER, HARRY; IRSIGLER, ROLAND; MEYER, THORSTEN
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016960/0283 →