IP Library Granted Patent US 7,393,463
Granted Patent B2
US 7,393,463 · App. 11/229,216 · Granted Jul 1, 2008

High temperature magnetorheological fluid compositions and devices

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Quick Facts
Patent No.
US 7,393,463
App. No.
11/229,216
Granted
Jul 1, 2008
Kind
B2
Abstract

A magnetorheological fluid composition comprising magnetizable particles in a liquid metal carrier fluid, wherein the liquid metal carrier fluid comprises a metal, a metal alloy, or a solder composition having a melting point from about −40° C. to about 300° C., a boiling point greater than 300° C., and a viscosity greater than about 0.1 centipoise (cp) at the melting point of the liquid based metal carrier fluid. The magnetizable particles can comprise low aspect ratio magnetizable particles, high aspect magnetizable particles, or a combination thereof. Also disclosed herein are high temperature magnetorheological devices operating at temperatures greater than 100° C., and comprising the magnetorheological fluid composition.

Claims (20)

1. A magnetorheological fluid composition comprising:

magnetizable particles; and

a liquid metal carrier fluid, wherein the liquid metal carrier fluid comprises a metal selected from the group consisting of lithium, sodium, potassium, rubidium, cesium, francium, beryllium, mercury, indium, and tin, or a metal alloy, or a solder composition having a melting point from about −40° C. to about 300° C., a boiling point greater than 300° C., and a viscosity greater than about 0.1 centipoise (cp) at the melting point of the liquid based metal carrier fluid.

2. The composition of claim 1 , wherein the metal alloy or the solder composition comprises lithium, sodium, potassium, rubidium, cesium, francium, beryllium, mercury, indium, tin, gallium, zinc, bismuth, lead, cadmium, silver, copper, gold, antimony, germanium, nickel, titanium, niobium, zirconium, aluminum, boron, silicon, and combinations comprising at least one of the foregoing.

3. The composition of claim 1 , wherein the magnetizable particles comprise low aspect ratio magnetizable particles, high aspect ratio magnetizable particles, or a combination thereof.

4. The composition of claim 3 , wherein the low aspect ratio magnetizable particles have an average particle size of about 0.1 micrometers to about 500 micrometers.

5. The composition of claim 3 , wherein the high aspect ratio magnetizable particles comprise whiskers, needles, rods, chips, tubes, strands, elongated platelets, lamellar platelets, ellipsoids, wires, or a combination comprising at least one of the foregoing.

6. The composition of claim 3 , wherein the high aspect ratio magnetizable particles comprise cross sectional geometries that are square, rectangular, triangular, circular, elliptical, polygonal, or a combination comprising at least one of the foregoing geometries.

7. The composition of claim 1 , further comprising a soldering flux composition that is liquid at an intended operating temperature.

8. The composition of claim 3 , wherein the high aspect ratio magnetizable particles and the low aspect ratio magnetizable particles are manufactured from iron, iron oxide, iron nitride, iron carbide, carbonyl iron, chromium dioxide, low carbon steel, silicon steel, nickel, cobalt, iron oxides that contain small amounts of manganese, zinc or barium; alloys of iron that contain aluminum, silicon, cobalt, nickel, vanadium, molybdenum, chromium, tungsten, manganese, copper, or a combination comprising at least one of the foregoing metals; iron-cobalt alloys having an iron to cobalt ratio ranging from about 30:70 to about 95:5; iron-nickel alloys having an iron to nickel ratio ranging from about 90:10 to about 99:1; or a combination comprising at least one of the foregoing.

9. The composition of claim 3 , wherein the high aspect ratio magnetizable particles and the low aspect ratio magnetizable particles are at a weight ratio of about 1:100 to about 100:1.

10. The composition of claim 1 , wherein the carrier fluid is at about 50 to about 95 volume percent based upon the total volume of the magnetorheological fluid composition.

11. A high temperature magnetorheological fluid device operating at a temperature greater than 100° C., the device comprising:

a magnetorheological fluid composition comprising magnetizable particles; and a liquid metal carrier fluid, wherein the liquid metal carrier fluid comprises a metal selected from the group consisting of lithium, sodium, potassium, rubidium, cesium, francium, beryllium, mercury, indium, and tin, a metal alloy, or a solder composition having a melting point from about −40° C. to about 300° C., a boiling point greater than 300° C., and a viscosity greater than about 0.1 centipoise (cp) at the melting point of the liquid based metal carrier fluid.

12. The device of claim 11 , wherein the magnetorheological fluid composition is fluidly coupled between at least two rotating members.

13. The device of claim 11 , wherein the magnetorheological fluid composition comprises low aspect ratio magnetizable particles, high aspect ratio magnetizable particles, or a combination thereof.

14. A magnetorheological fluid composition comprising:

high aspect ratio magnetizable particles; and

a liquid metal carrier fluid comprising gallium.

15. The composition of claim 14 , further comprising a soldering flux composition that is liquid at an intended operating temperature.

Assignments (12)
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2014
From: WILMINGTON TRUST COMPANY
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 034184/0001 →
CHANGE OF NAME Recorded Feb 10, 2011
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Reel/Frame 025780/0936 →
SECURITY AGREEMENT Recorded Nov 8, 2010
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: WILMINGTON TRUST COMPANY
Reel/Frame 025327/0041 →
RELEASE OF SECURITY INTEREST Recorded Nov 5, 2010
From: UAW RETIREE MEDICAL BENEFITS TRUST
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025314/0901 →
RELEASE OF SECURITY INTEREST Recorded Nov 4, 2010
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 025245/0587 →
SECURITY AGREEMENT Recorded Aug 28, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UAW RETIREE MEDICAL BENEFITS TRUST
Reel/Frame 023162/0093 →
SECURITY AGREEMENT Recorded Aug 27, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 023156/0142 →
RELEASE OF SECURITY INTEREST Recorded Aug 21, 2009
From: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023127/0402 →
RELEASE OF SECURITY INTEREST Recorded Aug 20, 2009
From: UNITED STATES DEPARTMENT OF THE TREASURY
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 023124/0519 →
SECURITY AGREEMENT Recorded Apr 16, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: CITICORP USA, INC. AS AGENT FOR BANK PRIORITY SECURED PARTIES; CITICORP USA, INC. AS AGENT FOR HEDGE PRIORITY SECURED PARTIES
Reel/Frame 022553/0493 →
SECURITY AGREEMENT Recorded Feb 4, 2009
From: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
To: UNITED STATES DEPARTMENT OF THE TREASURY
Reel/Frame 022201/0405 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2005
From: ULICNY, JOHN C.; GOLDEN, MARK A.
To: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
Reel/Frame 017130/0495 →