IP Library Granted Patent US 7,167,357
Granted Patent B2
US 7,167,357 · App. 11/259,503 · Granted Jan 23, 2007

Surface mount MELF capacitor

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Quick Facts
Patent No.
US 7,167,357
App. No.
11/259,503
Granted
Jan 23, 2007
Kind
B2
Abstract

The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.

Claims (25)

1. A surface mount MELF capacitor comprising:

a wire having opposite first and second ends;

a conductive powder element electrically surrounding the wire and having opposite ends, the

powder element being shorter than the wire so as to expose the first and second ends of the wire;

insulative material surrounding a portion of the powder element, and covering the ends of the

powder element, and surrounding the wire with the ends of the wire extending beyond the insulative material;

a first terminal surrounding an insulated portion of the powder element; and

a second terminal surrounding the second end of the wire.

2. The surface mount MELF capacitor of claim 1 wherein the first terminal is an anode and the second terminal is a cathode end.

3. The surface mount MELF capacitor of claim 1 wherein the conductive powder element is made of powder.

4. The surface mount MELF capacitor of claim 3 wherein the powder is from the group consisting of: Ta, Nb, Hf, Zr, Ti, V, W, Be, and Al.

5. The surface mount MELF capacitor of claim 3 wherein the powder is a substrate of a metal from the group consisting of: Ta, Nb, Hf, Zr, Ti, V, W, Be, and Al.

6. The surface mount MELF capacitor of claim 3 wherein the powder has been electrophoretically deposited upon the wire.

7. The surface mount MELF capacitor of claim 1 wherein the conductive powder element has a density between 3–8 g/cc.

8. The surface mount MELF capacitor of claim 1 wherein the conductive powder element has a capacitance-voltage between 10 CV and 150 KCV.

9. A series of surface mount MEILF capacitors produced using a reel to reel process, the series comprising:

a wire having opposite first and second ends and an outer circumference; and

a plurality of spaced apart surface mount MELF capacitors that have been formed upon the wire.

10. The series of surface mount MELF capacitors of claim 9 further comprising a cut point between each surface mount MELF capacitor.

11. The series of surface mount MELF capacitors of claim 9 wherein each surface mount MELF capacitor has:

a conductive powder element electrophoretically deposited upon the wire and having first and second ends, the powder element being shorter than the wire so as to expose the first and second ends of exposed wire;

an insulative layer formed around a portion of the conductive powder element, and

around the wire with the ends of the wire extending beyond the insulative layer;

an anode terminal surrounding an uninsulated portion of the powder element;

a cathode terminal of surrounding the second end of the wire.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →