Surface mount MELF capacitor
View Patent ↗The surface mount MELF capacitor of the present invention includes a wire and a conductive powder element electrically connected to the wire. The surface mount MELF capacitor has insulative material surrounding at least a portion of the conductive powder element and the wire extending from the conductive powder element. A first terminal is formed on the surface mount chip capacitor at the first end surface of the wire and a second terminal is formed by being electrically connected to the conductive powder element. The surface mount MELF capacitor of the present invention is created by methods which include the steps of providing a wire and placing conductive powder upon the wire. An embodiment of the present invention feeds the wire in a reel to reel system and electrophoretically deposits the conductive powder element upon the wire.
1. A method of creating a surface mount MELF capacitor comprising:
providing a wire having opposite first and secondends;
forming a conductive element around the wire with the ends of the wire extending beyond the conductive powder element;
the conductive element having a cathode end, an anode end;
applying insulation material over the conductive element, and around wire ends, with the wire ends extending beyond the insulation material;
exposing a portion of the cathode end of the conductive powder element;
applying an anode layer of conductive material around the wire first end and over the insulation material adjacent the anode end of the conductive element so that the anode layer of conductive material is in electrical contact with the wire end; and
applying a cathode layer of conductive material over the exposed portion of the cathode end of the conductive element.
2. The method of claim 1 further comprising the step arranging the wire for acceptance into a reel to reel process.
3. The method of claim 1 further comprising electrophoretically depositing the powder upon the wire.
4. The method of claim 3 wherein the conductive element is from the group consisting of: Ta, Nb, Hf, Zr, Ti, V. W, Be, and Al.
5. The method of claim 3 wherein the conductive element is a substrate of a metal from the group consisting of: Ta, Nb, Hf, Zr, Ti, V, W, Be, and Al.
6. The method of claim 3 wherein the conductive element has a density between 3-8 g/cc.
7. The method of claim 3 wherein the conductive element has a capacitance-voltage between 10 CV and 150 KCV.
8. The method of claim 1 wherein the step of exposing is performed using laser cutting.
9. A method of forming a series of surface mount MELF capacitors, comprising:
providing a wire having opposite first and second ends;
forming a plurality of spaced apart surface mount MELF capacitors on the wire using a reel to reel process.
10. The method of claim 9 further comprising:
electrophoretically depositing a conductive element upon the wire, with the ends of the wire extending beyond the powder element;
forming an insulative layer around a portion of the conductive element and around the wire ends, with the wire ends extending beyond the insulative layer;
forming an anode layer around an uninsulated portion of the conductive element;
forming a cathode layer around the second end of the wire.
11. The method of claim 9 further comprising electrophoretically depositing the powder upon the wire.
12. The method of claim 9 wherein the conductive element is from the group consisting of: Ta, Nb, Hf, Zr, Ti, V, W, Be, and Al.
13. The method of claim 9 wherein the conductive element is a substrate of a metal from the group consisting of: Ta, Nb, Hf, Zr, Ti, V, W, Be, and Al.
14. The method of claim 9 wherein the conductive element has a density between 3-8 g/cc.
15. The method of claim 9 wherein the conductive element has a capacitance-voltage between 10 CV and 150 KCV.