Scaling of functional assignments in packages
View Patent ↗A family of package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board. Each package substrate in the family includes a package substrate having a die side and a circuit board side. The package substrate has a size that is consistent for all of the package substrates in the family of package substrates. The die side has integrated circuit contacts disposed in a pattern designed to make electrical connections to a given integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit. The circuit board side has circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the package substrates in the family of package substrates.
1. A family of ball bond package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board, where each package substrate in the family comprises:
a package substrate having a die side and a circuit board side, the package substrate having a size that is consistent for all of the package substrates in the family of package substrates,
the die side having ball bond integrated circuit contacts disposed in a pattern designed to make electrical connections to a given one of the different sizes of integrated circuit in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit, and
the circuit board side having circuit board contacts with a same pattern and same functional assignments that are consistent for all of the package substrates in the family of package substrates.
2. A ball bond package substrate adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board, where the package substrate comprises:
a die side and a circuit board side, and having a size that is sufficient to accommodate all of the different sizes in the family of integrated circuits,
the die side having ball bond integrated circuit contacts disposed in a pattern designed to make electrical connections to the different sizes of integrated circuits in the family of integrated circuits, as defined by locations of contacts on the integrated circuits, and
the circuit board side having circuit board contacts disposed in a pattern and with functional assignments that are consistent for all of the integrated circuits in the family of integrated circuits.
3. A family of ball bond package substrates adapted to receive a family of integrated circuits having different sizes and provide electrical connections between the integrated circuits and a circuit board, where each package substrate in the family comprises:
a die side and a circuit board side, and having a size that is consistent for all of the package substrates in the family of package substrates,
the die side having ball bond integrated circuit contacts disposed in a pattern designed to make electrical connections to a given one of the different sizes of integrated circuits in the family of integrated circuits for which the package substrate is designed, as defined by locations of contacts on the given integrated circuit, where integrated circuit contacts that exceed a maximum number of unique integrated circuit contacts are commonly electrically connected within the package substrate, and
the circuit board side having circuit board contacts disposed in a pattern that is consistent for all of the package substrates in the family of package substrates.