Etch singulated semiconductor package
View Patent ↗In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.
1. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a leadframe strip having a plurality of leadframes formed therein, each of the leadframes including:
a die pad having opposed top and bottom surfaces, and a peripheral edge; and
a plurality of leads disposed in spaced relation to the die pad, each of the leads having opposed top and bottom surfaces and an inner end;
b) applying plating layers to the bottom surface of the die pad and the bottom surfaces of the leads in each of the leadframes such that the plating layers serve as an etch mask;
c) attaching semiconductor dies to respective ones of the die pads;
d) electrically connecting the semiconductor dies to the leads of respective ones of the leadframes;
e) forming a plurality of package bodies on the leadframe strip to at least partially encapsulate the leadframes and the semiconductor dies; and
f) etching away portions of the leadframe strip which extend between the leadframes and are not covered by the plating layers and the package bodies to separate the leadframes from each other.
2. The method of claim 1 wherein step (b) comprises applying the plating layers to the bottom surface of the die pad and the bottom surfaces of the leads of each of the leadframes such that the plating layers terminate inwardly from the peripheral edges of respective ones of the die pads and the inner ends of respective ones of the leads.
3. The method of claim 1 wherein step (c) comprises bonding the semiconductor dies to respective ones of the die pads.
4. The method of claim 1 wherein:
step (d) comprises electrically connecting the semiconductor dies to the leads of respective ones of the leadframes through the use of conductive wires; and
step (e) comprises forming the plurality of package bodies on the leadframe strip to at least partially encapsulate the leadframes, the semiconductor dies and the conductive wires.
5. The method of claim 1 wherein step (e) comprises forming the plurality of package bodies on the leadframe strip such that portions of each of the package bodies extend between the leads and the die pad of a respective one of the leadframes.
6. The method of claim 1 wherein step (f) is performed using a wet chemical etching technique.
7. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a leadframe strip having a plurality of leadframes formed therein, each of the leadframes including:
a die pad having opposed top and bottom surfaces, and a peripheral edge; and
a plurality of leads disposed in spaced relation to the die pad, each of the leads having opposed top and bottom surfaces and an inner end;
b) applying plating layers to the bottom surface of the die pad and the bottom surfaces of the leads in each of the leadframes such that the plating layers serve as an etch mask;
c) attaching semiconductor dies to respective ones of the die pads;
d) electrically connecting the semiconductor dies to the leads of respective ones of the leadframes; and
e) creating a plurality of protective structures on the leadframe strip to at least partially cover respective ones of the leadframes and corresponding ones of the semiconductor dies; and
f) etching away portions of the leadframe strip which extend between the leadframes and are not covered by the plating layers and the protective structures to separate the leadframes from each other.
8. The method of claim 7 wherein step (d) comprises electrically connecting the semiconductor dies to the leads of respective ones of the leadframes through the use of conductive wires.
9. The method of claim 8 wherein step (e) comprises forming a plurality of package bodies on the leadframe strip to at least partially encapsulate respective ones of the leadframes and corresponding ones of the semiconductor dies.
10. The method of claim 7 wherein (b) comprises applying the plating layers to the bottom surface of the die pad and the bottom surfaces of the leads of each of the leadframes such that the plating layers terminate inwardly from the peripheral edges of respective ones of the die pads and the inner ends of respective ones of the leads.
11. The method of claim 7 wherein step (e) comprises forming a plurality of cavities on the leadframe strip to at least partially encapsulate respective ones of the leadframes and circumvent corresponding ones of the die pads.
12. The method of claim 7 wherein step (c) comprises bonding the semiconductor dies to respective ones of the die pads.
13. The method of claim 11 wherein step (e) further comprises forming the plurality of cavities on the leadframe strip such that portions of each of the cavities extend between the leads and the die pad of a respective one of the leadframes.
14. The method of claim 7 wherein step (f) is performed using a wet chemical etching technique.
15. A method of fabricating a semiconductor package, comprising the steps of:
a) providing a leadframe strip having a plurality of leadframes formed therein;
b) applying plating layers to each of the leadframes such that the plating layers serve as an etch mask;
c) electrically connecting semiconductor dies to respective ones of the leadframes;
d) forming a plurality of package bodies on the leadframe strip to at least partially encapsulate respective ones of the leadframes and corresponding ones of the semiconductor dies; and
e) etching away portions of the leadframe strip which extend between the leadframes to separate the leadframes from each other.
16. The method of claim 15 wherein step (c) comprises bonding the semiconductor dies to portions of respective ones of the leadframes.
17. The method of claim 15 wherein:
step (c) comprises electrically connecting the semiconductor dies to portions of respective ones of the leadframes through the use of conductive wires; and
step (d) comprises forming the plurality of package bodies on the leadframe strip to at least partially encapsulate the leadframes, the semiconductor dies and the conductive wires.
18. The method of claim 15 wherein:
step (a) comprises providing a leadframe strip wherein each of the leadframes is formed to define a die pad having a bottom surface and a peripheral edge, and a plurality of leads disposed in spaced relation to the die pad, each of the leads having a bottom surface and an inner end; and
step (c) comprises mounting the semiconductor dies to respective ones of the die pads and electrically connecting the semiconductor dies to the leads of respective ones of the leadframes.
19. The method of claim 15 wherein step (e) is performed using a wet chemical etching technique.
20. The method of claim 16 wherein (b) comprises applying the plating layers to the bottom surface of the die pad and the bottom surfaces of the leads of each of the leadframes such that the plating layers terminate inwardly from the peripheral edges of respective ones of the die pads and the inner ends of respective ones of the leads.