Integrated circuit package system with heat sink

1. An integrated circuit package system comprising:

forming an external interconnect from a padless lead frame;

encapsulating a heat sink and an inner portion of the external interconnect including forming a first molding compound to a thickness equal to a sink thickness of the heat sink and forming the first molding compound having the thickness less than an interconnect height of the external interconnect;

mounting an integrated circuit die on the heat sink with an adhesive;

attaching an electrical interconnect between the integrated circuit die and the inner portion of the external interconnect; and

encapsulating the integrated circuit die, the heat sink, and the external interconnect.

2. The system as claimed in claim 1 wherein encapsulating the heat sink and the inner portion of the external interconnect from the bottom of the external interconnect comprises placing the heat sink within a center of the padless lead frame.

3. The system as claimed in claim 1 wherein attaching the electrical interconnect between the integrated circuit die and the inner portion of the external interconnect comprises attaching a bond wire between the integrated circuit die and the external interconnect.

4. The system as claimed in claim 1 wherein mounting the integrated circuit die on the heat sink with the adhesive comprises attaching the integrated circuit on the heat sink with a thermally conductive adhesive.

5. An integrated circuit package system comprising:

an external interconnect from a padless lead frame;

a first molding compound around a heat sink and the external interconnect, the first molding compound and the heat sink of equal thickness, and the first molding compound has less thickness than an interconnect height of the external interconnect;

an integrated circuit die in a recess of the heat sink; and

a second molding compound to cover the integrated circuit die in the recess, the heat sink, and the external interconnect.

6. The system as claimed in claim 5 further comprising a bottom surface of the heat sink exposed.

7. The system as claimed in claim 5 wherein the second molding compound to cover the integrated circuit die and the lead comprises:

the second molding compound attached to the first molding compound; and

a hermetic seal formed with the first molding compound and second molding compound.

8. The system as claimed in claim 5 wherein the first molding compound around the heat sink and the external interconnect comprises a registration of the heat sink in the first molding compound.

9. The system as claimed in claim 5 wherein:

the external interconnect forming the padless lead frame is a lead;

the first molding compound covers the heat sink and the external interconnect;

the integrated circuit die on the heat sink is a wire bond integrated circuit;

the second molding compound covers the integrated circuit die and the heat sink; and

further comprising:

the first molding compound from a bottom of the external interconnect;

an adhesive between the integrated circuit die and the heat sink; and

an electrical interconnect between the integrated circuit die and the external interconnect.

10. The system as claimed in claim 9 wherein the first molding compound to cover the heat sink and the external interconnect has the heat sink within a center of the padless lead frame.

11. The system as claimed in claim 9 wherein the electrical interconnect between the integrated circuit die and the external interconnect is a bond wire between the integrated circuit die and the external interconnect.

12. The system as claimed in claim 9 wherein the adhesive between the integrated circuit die and the heat sink is a thermally conductive adhesive for transferring heat from the integrated circuit die to the heat sink.