IP Library Granted Patent US 7,205,583
Granted Patent B1
US 7,205,583 · App. 11/317,213 · Granted Apr 17, 2007

Thyristor and method of manufacture

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Quick Facts
Patent No.
US 7,205,583
App. No.
11/317,213
Granted
Apr 17, 2007
Kind
B1
Abstract

A thyristor and a method for manufacturing the thyristor that includes providing a semiconductor substrate that has first and second major surfaces. A first doped region is formed in the semiconductor substrate, wherein the first doped extends from the first major surface into the semiconductor substrate. The first doped region has a vertical boundary that has a notched portion. A second doped region is formed in first doped region, wherein the second doped region extends from the first major surface into the first doped region. A third doped region is formed in the semiconductor substrate, wherein the third doped region extends from the second major surface into the semiconductor substrate.

Claims (30)

1. A thyristor, comprising:

a semiconductor substrate of a first conductivity type having first and second surfaces;

a first doped region of a second conductivity type extending from the first surface into the semiconductor substrate, the first doped region having a vertical boundary in the semiconductor substrate, wherein a portion of the vertical boundary has a first notch; and

a second doped region of the first conductivity type extending from the first surface into the first doped region.

2. The thyristor of claim 1 , further including a third doped region of the second conductivity type extending from the second surface into the semiconductor substrate, the third doped region having a vertical boundary.

3. The thyristor of claim 2 , further including a fourth doped region of the first conductivity extending from the second surface into the third doped region.

4. The thyristor of claim 3 , further including a fifth doped region of the first conductivity type extending from the first surface into the first doped region, the fifth doped region laterally spaced apart from the second doped region.

5. The thyristor of claim 4 , wherein the portion of the vertical boundary of the first doped region that has the first notch is vertically adjacent the second doped region and wherein the first notch and the second doped region cooperate to form a gain enhancement region in the first doped region.

6. The thyristor of claim 4 , wherein the portion of the vertical boundary of the first doped region that has the first notch is vertically adjacent the fifth doped region and wherein the first notch and the fifth doped region cooperate to form a gain enhancement region in the first doped region.

7. The thyristor of claim 3 , further including a fifth doped region of the first conductivity type extending from the second surface into the third doped region, the fifth doped region laterally spaced apart from the fourth doped region.

8. The thyristor of claim 7 , wherein the portion of the vertical boundary of the first doped region that has the first notch is vertically adjacent the second doped region and wherein the first notch and the second doped region cooperate to form a gain enhancement region in the first doped region.

9. The thyristor of claim 7 , further including a sixth doped region of the first conductivity type extending from the first surface into the semiconductor substrate, wherein the portion of the vertical boundary of the first doped region that has the first notch is vertically adjacent the sixth doped region and wherein the first notch and the sixth doped region cooperate to form a gain enhancement region in the first doped region.

10. The thyristor of claim 4 , further including a doped extension region of the first conductivity type extending from the second doped region into the first doped region.

11. The thyristor of claim 4 , wherein the doped extension region of the first conductivity type is adjacent the portion of the vertical boundary of the first doped region that has the first notch.

12. The thyristor of claim 4 , further including a doped extension region of the first conductivity type extending from the fifth doped region.

13. The thyristor of claim 12 , wherein the doped extension region of the first conductivity type is adjacent the portion of the vertical boundary of the first doped region that has the first notch.

14. The thyristor of claim 3 , wherein a portion of the vertical boundary of the third doped region has a second notch.

15. The thyristor of claim 14 , wherein the portion of the vertical boundary of the third doped region that has the second notch is vertically adjacent the fourth doped region and wherein the second notch and the fourth doped region cooperate to form a gain enhancement region in the second doped region.

16. The thyristor of claim 15 , further including a doped extension region of the first conductivity type extending from the fourth doped region into the third doped region.

17. The thyristor of claim 16 , wherein the notch in the vertical boundary of the third doped region is adjacent the doped extension region of the first conductivity type extending from the fourth doped region.

18. The thyristor of claim 4 , further including:

a sixth doped region of the second conductivity type extending from the first surface into the first doped region; and

a seventh doped region of the second conductivity type extending from the first surface into the first doped region.

19. The thyristor of claim 18 , further including an eighth doped region of the first conductivity type extending from the second surface into the third doped region.

20. A method for manufacturing a thyristor, comprising:

providing a semiconductor substrate of a first conductivity type, the semiconductor substrate having first and second surfaces;

forming a first doped region of a second conductivity type in the semiconductor substrate, the first doped region extending from the first surface into the semiconductor substrate and having a vertical boundary in the semiconductor substrate, wherein a portion of the vertical boundary has a notch; and

forming a second doped region of the first conductivity type in the semiconductor substrate, the second doped region extending from the first surface into the first doped region.

21. The method of claim 20 , further including forming a third doped region of the second conductivity type in the semiconductor substrate, the third doped region extending from the second surface into the semiconductor substrate and having a vertical boundary in the semiconductor substrate.

22. The method of claim 21 , wherein forming the third doped region includes forming the third doped region to have a notch in a portion of the vertical boundary.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: LITTELFUSE, INC.
Reel/Frame 042528/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: LITTELFUSE, INC.
Reel/Frame 042506/0256 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
PARTIAL RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620 FRAME 0087 Recorded Jun 14, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 038991/0888 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
RELEASE OF SECURITY INTEREST Recorded Sep 4, 2014
From: JPMORGAN CHASE BANK, N.A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033686/0092 →