Padless die support integrated circuit package system

1. An integrated circuit package method comprising:

forming a die support system from a padless lead frame having lead fingers and die supports with each die support substantially equally spaced from another, the die supports having equal widths;

applying bonding material to the die supports; and

attaching an integrated circuit die having a peripheral area to the bonding material on the die supports with the bonding material covering less area on the die supports than the total area of the die supports directly under the integrated circuit die.

2. The method as claimed in claim 1 wherein forming the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises forming die bars to support the integrated circuit die at the corners.

3. The method as claimed in claim 1 wherein forming the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises half etching a lower end of the die supports with the integrated circuit die on the lower end.

4. The method as claimed in claim 1 wherein forming the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises half etching a lower portion of the die supports with the integrated circuit die on an elevated end of the die supports.

5. The method as claimed in claim 1 wherein forming the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises bending an elevated end bend of the die supports for the integrated circuit die on the elevated end of the die supports.

6. An integrated circuit package method comprising:

forming a die support system from a padless lead frame having lead fingers and die supports with a number of the die supports equal to the number of sides of an integrated circuit die with each die support substantially equally spaced from another, the die supports having equal widths;

applying bonding material to the die supports; and

attaching the integrated circuit die having a peripheral area to the bonding material on the die supports with the bonding material covering less area on the die supports than the total area of the die supports directly under the integrated circuit die.

7. The method as claimed in claim 6 wherein forming the die support system from the padless lead frame having the die supports comprises forming fused leads to support the integrated circuit die at the edges.

8. The method as claimed in claim 6 wherein attaching the integrated circuit die comprises attaching each of the die supports on each corner of the integrated circuit die, respectively.

9. The method as claimed in claim 6 wherein attaching the integrated circuit die comprises attaching each of the die supports on each side of the integrated circuit die, respectively.

10. The method as claimed in claim 6 further comprising:

forming lead fingers from the padless lead frame; and

connecting electrical interconnects between the lead fingers and the integrated circuit die with a heater block having a vacuum orifice to attach the integrated circuit die to the die supports.

11. An integrated circuit package system comprising: a die support system from a padless lead frame having lead fingers and die supports with each substantially equally spaced from another, the die supports having equal widths, and the die support system with a bonding material; and

an integrated circuit die having a peripheral area on the die supports and the bonding material covers less area on the die supports than the total area of the die supports directly under the integrated circuit die.

12. The system as claimed in claim 11 wherein the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises die bars to support the integrated circuit die at the corners.

13. The system as claimed in claim 11 wherein the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises a lower end of the die supports with the integrated circuit die on the lower end.

14. The system as claimed in claim 11 wherein the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises a lower portion of the die supports with the integrated circuit die on an elevated end of the die supports.

15. The system as claimed in claim 11 wherein the die support system from the padless lead frame having the die supports with each substantially equally spaced from another comprises an elevated end bend of the die supports for the integrated circuit die on the elevated end of the die supports.

16. The system as claimed in claim 11 wherein:

the die support system from the padless lead frame having the die supports with each substantially equally spaced from another have the die supports similar in length to each other, and

the integrated circuit die having the peripheral area on the die supports with the non-active side of the integrated circuit die on the die supports,

further comprising:

a number of the die supports equal to the number of sides of the integrated circuit die.

17. The system as claimed in claim 16 wherein the die support system from the padless lead frame having the die supports comprises fused leads to support the integrated circuit die at the edges.

18. The system as claimed in claim 16 wherein each of the die supports is on each corner of the integrated circuit die, respectively.

19. The system as claimed in claim 16 wherein each of the die supports is on each side of the integrated circuit die, respectively.

20. The system as claimed in claim 16 further comprising:

lead fingers of the padless lead frame; and

electrical interconnects between the lead fingers and the integrated circuit die.