IP Library Granted Patent US 7,292,494
Granted Patent B2
US 7,292,494 · App. 11/339,624 · Granted Nov 6, 2007

Internal power management scheme for a memory chip in deep power down mode

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Quick Facts
Patent No.
US 7,292,494
App. No.
11/339,624
Granted
Nov 6, 2007
Kind
B2
Abstract

A method for a deep power down mode is described for a memory chip in which voltage regulators and charge pumps are turned off, memory cell voltages are floated, and support circuit internal power supply voltages are replaced by voltages that are derived from the external chip voltage. Prior to being placed into a deep power down mode, all memory cells are placed into a precharge state from which the memory cell voltages are floated upon entering the deep power down mode. Pass through circuits connect externally derived voltages to the support circuit power supply voltage lines, controlled by a deep power down signal. Maintaining a voltage bias on the support circuits prevents latch up problems when the memory chip is brought out of the deep power down mode.

Claims (25)

1. A deep power down circuit to save power in a low power memory chip, comprising:

a plurality of internal voltage generators, said internal voltage generators comprising:

a first group internal voltage generators which generate voltages related to the voltages of cells of the memory chip, any one of the first group internal voltage generators being in a first predetermined state in a deep power down mode, the first predetermined state being a grounding-level state or a floating-level state; and

a second group internal voltage generators which generate voltages not related to the voltages of the cells of the memory chip, any one of the second group internal voltage generators being in a second predetermined state in the deep power down mode, the second predetermined state being selected from the group consisting of a keep-level state, a grounding-level state, and a floating-level state.

2. The deep power down circuit of claim 1 , wherein any one of the first group internal voltage generators is in the first predetermined state after the cells of the memory chip are pre-charged, and any one of the second group internal voltage generators is in the second predetermined state after the cells of the memory chip are pre-charged.

3. The deep power down circuit of claim 1 , wherein the first group internal voltage generators comprises a plurality of voltage regulators and charge pump circuits internal to the low power memory chip.

4. The deep power down circuit of claim 1 , further comprising a grounding gate circuit coupled to the output of one of the first group internal voltage generators which is in the grounding-level state, wherein the grounding gate circuit is active to ground the output of the one of the first group internal voltage generators after the one of the first group internal voltage generators is turned off in the deep power down mode.

5. The deep power down circuit of claim 1 , wherein one of the first group internal voltage generators is in the floating-level state after the one of the first group internal voltage generators is turned off in the deep power down mode.

6. The deep power down circuit of claim 1 , wherein the second group internal voltage generators comprises a plurality of voltage regulators and charge pump circuits internal to the low power memory chip.

7. The deep power down circuit of claim 1 , further comprising a passing gate circuit coupled to the output of one of the second group internal voltage generators which is in the keep-level state, wherein the passing gate circuit is active and couples an external voltage of the low power memory chip to the output of the one of the second group internal voltage generators memory after the one of the second group internal voltage generators is turned off in the deep power down mode.

8. The deep power down circuit of claim 1 , further comprising a grounding gate circuit coupled to the output of one of the second group internal voltage generators which is in the grounding-level state, wherein the grounding gate circuit is active to ground the output of the one of the second group internal voltage generators after the one of the second group internal voltage generators is turned off in the deep power down mode.

9. The deep power down circuit of claim 1 , wherein one of the second group internal voltage generators is in the floating-level state after the one of the second group internal voltage generators is turned off in the deep power down mode.

10. A deep power down circuit comprising:

an IC chip; and

a plurality of internal voltage generators providing the chip with internal circuit power, any one of the plurality of internal voltage generators being in a predetermined state in a deep power down mode, the predetermined state selected from the group consisting of a keep-level state, a grounding-level state, and a floating-level state;

wherein one of the plurality of internal voltage generators is in the floating-level state after the one of the plurality of internal voltage generators is turned off in the deep power down mode.

11. A deep power down circuit comprising:

an IC chip;

a plurality of internal voltage generators providing the chip with internal circuit power, any one of the plurality of internal voltage generators being in a predetermined state in a deep power down mode, the predetermined state selected from the group consisting of a keep-level state, a grounding-level state, and a floating-level state; and,

a passing gate circuit coupled to the output of one of the plurality of internal voltage generators which is in the keep-level state, wherein the passing gate circuit is active and couples an external voltage of the IC chip to the output of the one of the plurality of internal voltage generators after the one of the plurality of internal voltage generators is turned off in the deep power down mode.

12. A deep power down circuit comprising:

an IC chip; and

a plurality of internal voltage generators providing the chip with internal circuit power, a first group of the internal voltage generators being in a keep-level state during a deep power down mode, a second group of the internal voltage generators being in a grounding-level state during the deep power down mode;

wherein the keep-level state is different from the grounding-level state.

13. The deep power down circuit of claim 12 , further comprising a third group of the plurality of internal voltage generators being in a floating-level state during the deep power down mode.

Assignments (9)
SECURITY INTEREST Recorded Jun 25, 2024
From: KINETIC PRESSURE CONTROL LIMITED
To: LENDER JB, LLC
Reel/Frame 067832/0898 →
RELEASE OF SECURITY INTEREST Recorded Nov 10, 2020
From: CPPIB CREDIT INVESTMENTS INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 054372/0194 →
RELEASE OF U.S. PATENT AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Oct 12, 2018
From: ROYAL BANK OF CANADA, AS LENDER
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 047645/0424 →
AMENDED AND RESTATED U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Aug 22, 2018
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS, INC.
Reel/Frame 046900/0136 →
U.S. PATENT SECURITY AGREEMENT (FOR NON-U.S. GRANTORS) Recorded Sep 9, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CPPIB CREDIT INVESTMENTS INC., AS LENDER; ROYAL BANK OF CANADA, AS LENDER
Reel/Frame 033706/0367 →
CHANGE OF ADDRESS Recorded Sep 3, 2014
From: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 033678/0096 →
CHANGE OF NAME Recorded Mar 13, 2014
From: MOSAID TECHNOLOGIES INCORPORATED
To: CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC.
Reel/Frame 032439/0638 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2013
From: ETRON TECHNOLOGY INC.
To: MOSAID TECHNOLOGIES INC.
Reel/Frame 029630/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2006
From: HSU, JEN-SHOU; TING, TAH-KANG JOSEPH; WANG, MING-HUNG; RONG, BOR-DOOU
To: ETRON TECHNOLOGY INC.
Reel/Frame 017232/0008 →