Contacting device, testing method and corresponding production method
View Patent ↗A contacting device comprises a carrier device with a first surface, a plurality of first terminal regions on the first surface, at least one elastic elevation on the first surface, and a plurality of interconnects, each running from a respective of the first terminal regions to an upper side of the elastic elevation. The plurality of first terminal regions is configured so that signals of a tester device can be fed to the plurality of first terminal regions, the interconnects have first contact regions located at the upper side of the elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit, and the first contact regions comprise first particles for roughening the surface of the first contact regions.
1. A contacting device, comprising:
a carrier device with a first surface;
a plurality of first terminal regions on said first surface; said plurality of first terminal regions being configured so that signals are fed to said plurality of first terminal regions;
at least one elastic elevation on said first surface; said elastic elevation comprising an upper side; and
a plurality of interconnects, each running from a respective of said first terminal regions to said upper side of said elastic elevation; said interconnects having first contact regions located at said upper side of said elastic elevation configured to be contacted electrically with corresponding second contact regions of an integrated circuit and said first contact regions comprising first particles for roughening the surface of said first contact regions.
2. The device of claim 1 , wherein said elastic elevation comprises an elastomer and second particles for roughening the surface of said elastic elevation are incorporated or applied into said surface and are molded into said surface.
3. The device of claim 1 , wherein said first particles have the form of protuberances.
4. The device of claim 1 , wherein said first particles have a grain size in the range of 3 to 20 μm.
5. The device of claim 1 , wherein said interconnects are made from copper.
6. The device of claim 1 , wherein said interconnects are coated with nickel and subsequently with hard gold.
7. The device of claim 1 , wherein said elastic elevation has an elongate wall-like shape.
8. The device of claim 7 , wherein said elastic elevation is a first elastic elevation and said device comprises a second elastic elevation running parallel to said first elastic elevation.
9. The device of claim 1 , comprising a plurality of second terminal regions connected to said first terminal regions via holes through said carder device which comprises a second surface; said plurality of second terminal regions being provided on said second surface.