IP Library Granted Patent US 7,474,815
Granted Patent B2
US 7,474,815 · App. 11/374,777 · Granted Jan 6, 2009

Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,474,815
App. No.
11/374,777
Granted
Jan 6, 2009
Kind
B2
Abstract

For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Claims (5)

1. A method of interconnecting or mapping optoelectronic devices to waveguides; said method comprising:

arranging a plurality of said optoelectronic devices to form an optoelectronic module, said optoelectronic module having said optoelectronic device arranged in a two-dimensional array;

connecting a plurality of said waveguides to said optoelectronic devices in a one-dimensional array of said waveguides, and wherein said module comprises arraying said plurality of optoelectronic devices in selectively a rectangular, square or rhomboidal array, said waveguides extending from said optoelectronic devices in substantially linear mutually parallel orientations;

said substantially linear parallel orientations of said waveguides being at a fixed angle compared to a two-dimensional grid represented by said optoelectronic devices and extending along paths routed to a circuit board at an arbitrary angle for minimizing waveguide losses; and

wherein a maximum number of optoelectronic device array rows is defined by the pitch between elements on said optoelectronic devices, waveguide core widths, and minimum separation between waveguide cores.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
SECURITY AGREEMENT Recorded Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2014
From: AGILENT TECHNOLOGIES, INC.
To: KEYSIGHT TECHNOLOGIES, INC.
Reel/Frame 033746/0714 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2006
From: BUDD, RUSSELL A.; CHINIWALLA, PUNIT P.; GUCKENBERGER, JOHN A.; KASH, JEFFREY A.; SCHAUB, JEREMY D.; TAN, MICHAEL; TREWHELLA, JEANNINE M.; TROTT, GARRY
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 017613/0587 →