IP Library Granted Patent US 7,615,771
Granted Patent B2
US 7,615,771 · App. 11/380,498 · Granted Nov 10, 2009

Memory array having memory cells formed from metallic material

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Quick Facts
Patent No.
US 7,615,771
App. No.
11/380,498
Granted
Nov 10, 2009
Kind
B2
Abstract

Solid-state memories are disclosed that are comprised of cross-point memory arrays. The cross-point memory arrays include a first plurality of electrically conductive lines and a second plurality of electrically conductive lines that cross over the first plurality of electrically conductive lines. The memory arrays also include a plurality of memory cells located between the first and second conductive lines. The memory cells are formed from a metallic material, such as FeRh, having the characteristic of a first order phase transition due to a change in temperature. The first order phase transition causes a corresponding change in resistivity of the metallic material.

Claims (27)

1. A memory array comprising:

a plurality of word lines;

a plurality of bit lines; and

a plurality of memory cells located at the intersections of the word lines and the bit lines;

wherein the memory cells consist of a single layer of a metallic alloy, wherein the metallic alloy comprises Fe and Rh.

2. The memory array of claim 1 wherein the magnetic alloy exhibits a first order phase transition from a low temperature high resistivity state to a high temperature low resistivity state.

3. The memory array of claim 1 wherein the metallic alloy comprises FeRh.

4. The memory array of claim 1 wherein the metallic alloy further comprises one of Ir, Pt, Pd, or Ni.

5. A memory array comprising:

a first plurality of electrically conductive lines;

a second plurality of electrically conductive lines that cross over the first plurality of electrically conductive lines at intersection regions; and

a plurality of memory cells located at the intersection regions between the first plurality of electrically conductive lines and the second plurality of electrically conductive lines;

wherein the memory cells consist of a single layer of a metallic alloy, wherein the metallic alloy comprises at least Fe and Rh.

6. The memory array of claim 5 wherein a characteristic of the metallic alloy includes a first order phase transition due to a temperature change and substantially completing the transition in the range of about 20° C. or less.

7. The memory array of claim 6 wherein the first order phase transition is from a low temperature high resistivity state to a high temperature low resistivity state.

8. The memory array of claim 5 wherein the metallic alloy further includes one of Ir, Pt, Pd, or Ni.

9. A memory array comprising:

a first plurality of electrically conductive lines;

a second plurality of electrically conductive lines that cross over the first plurality of electrically conductive lines; and

a plurality of memory cells between the first plurality of electrically conductive lines and the second plurality of electrically conductive lines, wherein each of the plurality of memory cells contacts one of the first plurality of electrically conductive lines and contacts one of the second plurality of electrically conductive lines;

wherein the memory cells consist entirely of a metallic alloy, wherein the metallic alloy comprises Fe and Rh.

10. The memory array of claim 9 wherein the metallic alloy exhibits a first order phase transition due to a temperature change in the range of about 20° C. or less.

11. The memory array of claim 10 wherein the first order phase transition is from a low temperature high resistivity state to a high temperature low resistivity state occurring at a transition temperature.

12. The memory array of claim 11 wherein the transition temperature is increased by doping the metallic alloy with one of Jr or Pt.

13. The memory array of claim 11 wherein the transition temperature is decreased by doping the metallic alloy with one of Pd or Ni.

14. The memory array of claim 10 wherein the first order phase transition is from an antiferromagnetic phase to a ferromagnetic phase.

15. The memory array of claim 9 wherein the memory cell is comprised entirely of FeRh.

Assignments (11)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040821/0550 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →