LGA fixture for indium assembly process
View Patent ↗An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate that may be removably seated thereon. The surfaces of the plurality of pillars have a first footprint at least as large as a footprint of the substrates to be placed thereon. A plate is provided for applying a compressive force to an integrated circuit lid positioned on any of the substrates removably seated on the pillars.
1. A method of attaching a lid to a substrate, comprising:
providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
placing the substrate on one of the plurality of pillars, the substrate having an integrated circuit positioned thereon; and
attaching the lid to the substrate.
2. The method of claim 1 , wherein the attaching of the lid comprises applying an adhesive to the substrate and putting the lid in contact with the adhesive.
3. The method of claim 2 , comprising heating the lid before putting the lid in contact with the adhesive.
4. The method of claim 1 , comprising placing a thermal interface material on the integrated circuit prior to attaching the lid.
5. The method of claim 4 , wherein the thermal interface material comprises indium.
6. The method of claim 5 , comprising reflowing the indium by heating after attaching the lid.
7. The method of claim 6 , comprising precuring the adhesive prior to reflowing the indium.
8. The method of claim 7 , comprising curing the adhesive after reflowing the indium.
9. A method of attaching a lid to a substrate, comprising:
providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
placing the substrate on one of the plurality of pillars, the substrate having an integrated circuit positioned thereon;
positioning an indium film on the integrated circuit;
attaching the lid to the substrate; and
wetting the indium to both the integrated circuit and the lid by reflowing.
10. The method of claim 9 , wherein the attaching of the lid comprises applying an adhesive to the substrate and putting the lid in contact with the adhesive.
11. The method of claim 10 , comprising heating the lid before putting the lid in contact with the adhesive.
12. The method of claim 11 , comprising precuring the adhesive prior to reflowing the indium.
13. The method of claim 12 , comprising curing the adhesive after reflowing the indium.
14. A method of attaching a lid to a substrate, comprising:
providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
placing the substrate on one of the plurality of pillars, the substrate having a microprocessor positioned thereon;
positioning an indium film on the integrated circuit;
attaching a nickel coated copper lid to the substrate; and
wetting the indium to both the microprocessor and the lid by reflowing.
15. The method of claim 14 , wherein the attaching of the lid comprises applying an adhesive to the substrate and putting the lid in contact with the adhesive.
16. The method of claim 15 , comprising heating the lid before putting the lid in contact with the adhesive.
17. The method of claim 16 , comprising precuring the adhesive prior to reflowing the indium.
18. The method of claim 17 , comprising curing the adhesive after reflowing the indium.