Method of fabricating an integrated circuit with etched ring and die paddle
View Patent ↗An integrated circuit package system is provided including forming a D-ring comprising half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.
1. An integrated circuit package system comprising:
forming a D-ring comprises:
half etching a paddle,
etching a ring, and
etching a tie bar, the tie bar is between the paddle and the ring;
placing the D-ring on a clamper;
half etching an external interconnect;
mounting an integrated circuit die on the paddle and the tie bar with a die-ring gap between the integrated circuit die and the ring;
connecting the integrated circuit die and the ring;
connecting the integrated circuit die and the external interconnect; and
encapsulating the integrated circuit die, the ring, a portion of the external interconnect, and a portion of the paddle.
2. The system as claimed in claim 1 further comprising forming a slot between the ring and the paddle to eliminate resin bleed on the ring from an adhesive.
3. The system as claimed in claim 1 wherein mounting the integrated circuit die on the paddle and the tie bar includes attaching the integrated circuit die with an adhesive.
4. The system as claimed in claim 1 wherein half etching the external interconnect includes half etching the external interconnect, having an inner portion, the inner portion etched.