Semiconductor device
View Patent ↗A semiconductor device of unipolar type has Schottky-contacts ( 6 ) laterally separated by regions in the form of additional layers ( 7, 7 ″) of semiconductor material on top of a drift layer ( 3 ). Said additional layers being doped according to a conductivity type being opposite to the one of the drift layer. At least one ( 7 ″) of the additional layers has a substantially larger lateral extension and thereby larger area of the interface to the drift layer than adjacent such layers ( 7 ) for facilitating the building-up of a sufficient voltage between that layer and the drift layer for injecting minority charge carriers into the drift layer upon surge for surge protection.
1. A semiconductor device having
a source contact ( 1 ) and a drain contact ( 2 ) interconnected by a drift layer ( 3 ) doped by dopants according to a first conductivity type, n or p and in a conducting path between the source contact and the drain contact in a forward biased state of the device,
on top of the drift layer ( 3 ), a plurality of metal layer regions ( 6 ) belonging to the source contact making Schottky-contacts to the drift layer ( 3 ) and being laterally separated by regions in the form of additional layers ( 7 , 7 ″) of semiconductor material doped by dopants according to a second conductivity type being opposite to said first type constituting pn-junctions at the interface thereof to the drift layer ( 3 ) and a continuous blocking pn-junction in the reverse biased state of the device shielding said Schottky-contact regions,
said source contact on said additional layers, wherein
at least one ( 7 ″) of said additional layers having a substantially larger lateral extension and area of the interface to the drift layer ( 3 ) than adjacent such layers ( 7 ), and
each said additional layer ( 7 , 7 ″) is located on top of said drift layer ( 3 ) while forming an interface to said drift layer ( 3 ) laterally restricted by said Schottky-contact regions ( 6 ),
with said metal layer regions ( 6 ) situated on a side of said additional layers ( 7 , 7 ″) opposite said drift layer ( 3 ) and also laterally bordering said additional layers ( 7 , 7 ″) and separating said additional layers ( 7 , 7 ″) from one another,
such that said metal layer regions ( 6 ) completely border each said additional layer ( 7 , 7 ″) on all sides except a side on the drift layer ( 3 ).
2. A device according to claim 1 , wherein in the lateral direction along the top of the drift layer ( 3 ) at least every seventh of said additional layers ( 7 , 7 ″) has a substantially larger lateral extension than adjacent such additional layers.
3. A device according to claim 1 , wherein at least one additional layer ( 7 ″) has a lateral extension being equal to the lateral extension of said adjacent additional layers ( 7 ) multiplied by a factor of at least 1.5.
4. A device according to claim 1 , wherein the lateral extension of said at least one additional layer ( 7 ″) is approximately 5 μm-15 μm, and the lateral extension of adjacent such additional layers ( 7 ) is approximately 2 μm-4 μm.
5. A device according to claim 1 , wherein the lateral distance between adjacent additional layers ( 7 , 7 ″) is substantially constant along the top of the drift layer ( 3 ).
6. A device according to claim 1 , wherein said Schottky-contact regions ( 6 ) and said additional layers ( 7 , 7 ″) are arranged on top of the drift layer ( 3 ) in the form of concentric rings each having a substantially constant width and said lateral extension is in the direction according to a radius of these rings.
7. A device according to claim 5 , wherein the distance between adjacent additional layers ( 7 , 7 ″) is approximately the same or smaller than the thickness of the drift layer ( 3 ).
8. A device according to claim 1 , wherein said drift layer ( 3 ) has a thin low doped first sublayer ( 4 ) next to the Schottky-contact regions ( 6 ) and said additional layers ( 7 , 7 ″) and a higher doped second sub-layer ( 5 ) thereunder next to the drain contact ( 2 ).
9. A device according to claim 1 , wherein said Schottky-contact regions ( 6 ) are located at the bottom of a recess ( 11 ) into the drift layer ( 3 ) each separating adjacent said additional layers ( 7 , 7 ″) and positioning said Schottky-contacts at a vertical distance below the interfaces between said additional layers ( 7 , 7 ″) and the drift layer ( 3 ).
10. A device according to claim 1 , wherein said additional layers ( 7 , 7 ″) are highly doped.
11. A device according to claim 1 , wherein the semiconductor layers ( 3 , 7 , 7 ″) thereof are made of SiC, and said first conductivity tape is n and said second conductivity type is p for surge protection by hole injection into the drift layer.
12. A device according to claim 1 , wherein the semiconductor layers ( 3 , 7 , 7 ″) thereof are made of diamond, and said first conductivity type is p and said second conductivity type is n for surge protection by electron injection into the drift layer.
13. A device according to claim 3 , wherein the lateral extension is multiplied by a factor of at least 2.
14. A device according to claim 13 , wherein the lateral extension is multiplied by a factor of about 2-4.
15. A device according to claim 14 , wherein the lateral extension is multiplied by a factor of about 3-4.
16. A semiconductor device having
a source contact ( 1 ) and a drain contact ( 2 ) interconnected by a drift layer ( 3 ) doped by dopants according to a first conductivity type, n or p and in a conducting path between the source contact and the drain contact in a forward biased state of the device,
on top of the drift layer ( 3 ), a plurality of metal layer regions ( 6 ) belonging to the source contact making Schottky-contacts to the drift layer ( 3 ) and being laterally separated by regions in the form of additional layers ( 7 , 7 ″) of semiconductor material on top of said drift layer ( 3 ) and doped by dopants according to a second conductivity type being opposite to said first type constituting pn-junctions at the interface thereof to the drift layer ( 3 ) and a continuous blocking pn-junction in the reverse biased state of the device shielding said Schottky-contact regions,
said source contact on said additional layers, wherein
at least one ( 7 ″) of said additional layers having a substantially larger lateral extension and area of the interface to the drift layer ( 3 ) than adjacent such layers ( 7 ),
said drift layer ( 3 ) has two sub-layers, a first low doped sublayer ( 4 ) closest to the source contact ( 1 ) and a highly-doped second sub-layer ( 5 ) closest to the drain contact ( 2 ), and
said metal layer regions ( 6 ) are situated on a side of said additional layers ( 7 , 7 ″) opposite said drift layer ( 3 ) and also laterally border said additional layers ( 7 , 7 ″) to separate said additional layers ( 7 , 7 ″) from one another,
such that said metal layer regions ( 6 ) completely border each said additional layer ( 7 , 7 ″) on all sides except a side on the drift layer ( 3 ).
17. A device according to claim 16 , wherein said semiconductor layers ( 3 , 7 , 7 ″) thereof are made of SiC, said first conductivity type is n and said second conductivity type is p for surge protection by hole injection into the drift layer ( 3 ) and said first sub-layer ( 4 ) has a doping concentration below 10 15 cm −3 and said second sub-layer ( 5 ) has a doping concentration above 10 16 cm −3 .
18. A device according to claim 2 , wherein in the lateral direction along the top of the drift layer ( 3 ) at least every sixth of said additional layers ( 7 , 7 ″) has a substantially larger lateral extension than adjacent such additional layers.
19. A device according to claim 18 , wherein in the lateral direction along the top of the drift layer ( 3 ) at least every fifth of said additional layers ( 7 , 7 ″) has a substantially larger lateral extension than adjacent such additional layers.
20. A device according to claim 19 , wherein in the lateral direction along the top of the drift layer ( 3 ) at least every fourth of said additional layers ( 7 , 7 ″) has a substantially larger lateral extension than adjacent such additional layers.
21. A device according to claim 20 , wherein in the lateral direction along the top of the drift layer ( 3 ) at least every third of said additional layers ( 7 , 7 ″) has a substantially larger lateral extension than adjacent such additional layers.
22. A device according to claim 1 , wherein each said additional layer ( 7 , 7 ″) comprises a substantially rectangular cross-section bordering said metal layer regions ( 6 ) on three sides and drift layer ( 3 ) on one side.
23. A device according to claim 1 , wherein said metal layer regions ( 6 ) wrap around each said additional layer ( 7 , 7 ″) such that edges of said metal layer regions ( 6 ) wrapping around each said additional layer ( 7 , 7 ″) in a direction extending away from said drain contact ( 2 ) and drift layer ( 3 ) are substantially parallel and define an open trench or recess ( 11 ) between the edges of said metal layer regions ( 6 ) and in a lateral direction between said adjacent additional layers ( 7 , 7 ″).
24. A device according to claim 16 , wherein said Schottky-contact regions ( 6 ) are located at the bottom of a recess ( 11 ) into the drift layer ( 3 ) each separating adjacent said additional layers ( 7 , 7 ″) from one another in a lateral direction and positioning said Schottky-contacts at a vertical distance normal to the lateral direction and below the interfaces between said additional layers ( 7 , 7 ″) and the drift layer ( 3 ) on respective sides of said additional layers ( 7 , 7 ″).
25. A device according to claim 16 , wherein each said additional layer ( 7 , 7 ″) comprises a substantially rectangular cross-section bordering said metal layer regions ( 6 ) on three sides and drift layer ( 3 ) on one side.
26. A device according to claim 16 , wherein said metal layer regions ( 6 ) wrap around each said additional layer ( 7 , 7 ″) such that edges of said metal layer regions ( 6 ) wrapping around each said additional layer ( 7 , 7 ″) in a direction extending away from said drain contact ( 2 ) and drift layer ( 3 ) are substantially parallel and define an open trench or recess ( 11 ) between the edges of said metal layer regions ( 6 ) and in a lateral direction between said adjacent additional layers ( 7 , 7 ″).
27. A device according to claim 1 , wherein said metal layer regions ( 6 ) border each said additional layer ( 7 , 7 ″) on all sides except a side of each said additional layer ( 7 , 7 ″) bordering the drift layer ( 3 ) and only said metal layer regions ( 6 ) and drift layer ( 3 ) border each said additional layer ( 7 , 7 ″).
28. A device according to claim 16 , wherein said metal layer regions ( 6 ) border each said additional layer ( 7 , 7 ″) on all sides except a side of each said additional layer ( 7 , 7 ″) bordering the drift layer ( 3 ) and only said metal layer regions ( 6 ) and drift layer ( 3 ) border each said additional layer ( 7 , 7 ″).