Integrated circuit package system

1. An integrated circuit package system comprising:

forming a substrate having a first surface and a second surface;

mounting a first device over the first surface;

forming an encapsulation having a planar top surface to cover the first device and the substrate spanning to an extraction side of the encapsulation;

forming a recess in the encapsulation from the planar top surface next to the extraction side;

mounting a second device on the first surface at a side of the recess opposite the first device; and

forming a nonorthogonal lower segment with a portion of the second surface exposed at the insertion side.

2. The system as claimed in claim 1 wherein mounting the first device includes mounting a passive component.

3. The system as claimed in claim 1 wherein mounting the first device includes mounting an integrated circuit die.

4. The system as claimed in claim 1 wherein forming the first device includes forming a communication access device, a storage device, or an identity verification device.

5. An integrated circuit package system comprising:

a substrate having a first surface and a second surface;

a device over the substrate and attached to the first surface;

an encapsulation, having a planar top surface and a recess from the planar top surface, comprised of a mold resin to cover the device and the substrate spanning to an extraction side of the encapsulation;

a second device on the first surface at a side of the recess opposite the device; and further comprising:

a nonorthogonal lower segment with a portion of the second surface exposed at the insertion side.

6. The system as claimed in claim 5 wherein the device is a passive component.

7. The system as claimed in claim 5 wherein the device is an integrated circuit die.

8. The system as claimed in claim 5 wherein the device is a communication access device, a storage device, or an identity verification device.