Integrated circuit package-in-package system

1. An integrated circuit package-in-package system comprising:

forming an external interconnect having an upper portion and a lower portion;

forming a cover under a first integrated circuit die to form a packaged device;

mounting an active device over the packaged device;

connecting the active device to the packaged device and the upper portion; and

molding an encapsulation around the cover of the packaged device, the active device, and the upper portion.

2. The system as claimed in claim 1 wherein mounting the active device includes forming an integrated circuit die.

3. The system as claimed in claim 1 wherein forming the packaged device includes mounting a second integrated circuit die under the first integrated circuit die.

4. The system as claimed in claim 1 wherein the molding includes exposing the lower portion.

5. The system as claimed in claim 1 further comprising:

forming a paddle; and

mounting the packaged device over the paddle.

6. An integrated circuit package-in-package system comprising:

forming an external interconnect, having an upper portion and a lower portion, and a paddle;

a cover under a first integrated circuit die to form a packaged device;

mounting the packaged device, having an external contact, on the paddle;

mounting an active device over the packaged device and the paddle;

connecting the active device to the external contact and the upper portion; and

molding an encapsulation around the cover of the packaged device, the active device, the paddle, and the upper portion.

7. The system as claimed in claim 6 wherein the connecting includes connecting external contact and the upper portion.

8. The system as claimed in claim 6 wherein mounting the packaged device on the paddle includes attaching the cover of the packaged device to the paddle.

9. The system as claimed in claim 6 wherein mounting the packaged device on the paddle includes attaching a mount structure of the packaged device to the paddle.

10. The system as claimed in claim 6 further comprising forming an electronic system having the integrated circuit package-in-package system.

11. An integrated circuit package-in-package system comprising:

an external interconnect having an upper portion and a lower portion;

a packaged device having a cover under a first integrated circuit die;

an active device over the packaged device;

an internal interconnect from the active device to the packaged device and the upper portion; and

an encapsulation round the cover of the packaged device, the active device, and the upper portion.

12. The system as claimed in claim 11 wherein the active device is an integrated circuit die.

13. The system as claimed in claim 11 wherein the packaged device includes a second integrated circuit die under the first integrated circuit die.

14. The system as claimed in claim 11 wherein the encapsulation has the lower portion exposed.

15. The system as claimed in claim 11 further comprising a paddle with the packaged device thereon.

16. The system as claimed in claim 11 wherein:

the external interconnect is a lead having the upper portion and the lower portion;

the packaged device has an external contact;

the active device has an integrated circuit over the packaged device;

the internal interconnect, from the active device to the packaged device and to the upper portion, is a wire;

the encapsulation to cover the packaged device, the active device, and the upper portion has the lower portion exposed; and

further comprising:

a paddle with the packaged device over the paddle.

17. The system as claimed in claim 16 wherein the internal interconnect is between external contact and the upper portion.

18. The system as claimed in claim 16 wherein the packaged device has a cover to the paddle.

19. The system as claimed in claim 16 wherein the packaged device has a mount structure to the paddle.

20. The system as claimed in claim 16 further comprising an electronic system having the integrated circuit package-in-package system.