Non-planar packaging of image sensor

1. An apparatus, comprising:

a non-planar frame base; and

an image sensor die having a front side coupled to the non-planar frame base, such that light is receivable by the image sensor die through a backside of the image sensor die,

wherein a thickness of the image sensor die is chosen to detect selected wavelengths of the light.

2. The apparatus of claim 1 , wherein the non-planar frame base is curved.

3. The apparatus of claim 1 , wherein the non-planar frame base comprises a concave depression.

4. The apparatus of claim 3 , further comprise one or more lenses coupled to the image sensor, the one or more lenses having a pupil.

5. The apparatus of claim 4 , wherein the image sensor die comprises a plurality of pixels, and wherein the concave depression is configured such that chief rays entering the pupil are substantially perpendicular to the image sensor surface for substantially all of the plurality of pixels.

6. The apparatus of claim 3 , wherein the concave depression has a radius of curvature approximately in a range of 2 mm to 10 mm.

7. The apparatus of claim 3 , wherein the depression is one of a spherical depression, a cylindrical depression or a parabolic depression.

8. The apparatus of claim 1 , wherein the non-planar frame base comprises a convex depression.

9. The apparatus of claim 3 , further comprising a lead frame having the frame base.

10. The apparatus of claim 5 , wherein the image sensor die is flexed when coupled to the non-planar frame base.

11. A method, comprising:

forming a depression in a frame base;

flexing an image sensor die having a plurality of pixels; and

coupling a front side of an image sensor die to the frame base in the depression, such that light is receivable by the image sensor die through a backside of the image sensor die,

wherein a thickness of the image sensor die is chosen to detect selected wavelengths of the light.

12. The method of claim 11 , further comprising:

thinning a wafer comprising a plurality of the image sensor dies to a thickness sufficient to flex the plurality of image sensor dies; and

dicing the wafer to separate the plurality of image sensor dies.

13. The method of claim 12 , wherein the flexed image sensor dies induce strain in the semiconductor lattice for the image sensor die.

14. The method of claim 11 , wherein forming a depression comprises stamping the frame base.

15. The method of claim 11 , wherein forming a depression comprises molding the frame base.

16. The method of claim 11 , wherein forming a depression comprises forging or milling the frame base.

17. The method of claim 11 , wherein the depression is formed such that chief rays entering a pupil of one or more lenses to be coupled to the image sensor die are substantially perpendicular to the image sensor surface for substantially all of the plurality of pixels.

18. An optical system, comprising:

an image sensor die having a plurality of pixels disposed in a package to receive light through a backside image sensor surface,

wherein a thickness of the image sensor die is chosen to detect selected wavelengths of the light;

one or more lenses having a pupil coupled with the image sensor die; and

means for receiving chief rays, entering the pupil, substantially perpendicular to the backside image sensor surface for substantially all of the plurality of pixels.

19. The optical system of claim 18 , further comprising a color filter disposed between the one or more lenses and the backside image sensor surface.

20. The optical system of claim 18 , wherein the means for receiving minimizes optical cross talk among the plurality of pixels.