Tantalum CMP compositions and methods
View Patent ↗A composition suitable for tantalum chemical-mechanical polishing (CMP) comprises about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive, about 0.1 to about 10 percent by weight of an alkali metal iodate salt and an aqueous carrier. The composition has a pH of at least about 10. The composition is utilized to polish a surface of a tantalum-containing substrate.
1. A chemical-mechanical polishing composition for polishing a tantalum containing substrate consisting essentially of:
(a) about 0.1 to about 10 percent by weight of a zirconia or fumed alumina abrasive;
(b) about 0.1 to about 10 percent by weight of an alkali metal iodate salt; and
(c) an aqueous liquid carrier therefor
the composition having a pH of at least about 10.
2. The composition of claim 1 wherein the alkali metal iodate salt is potassium iodate.
3. The composition of claim 1 wherein the abrasive is present in the composition in an amount in the range of about 0.25 to about 5 percent by weight.
4. The composition of claim 1 wherein the alkali metal iodate salt is present in the composition at a concentration in an amount in the range of about 0.25 to about 5 percent by weight.
5. The composition of claim 1 wherein the composition has a pH of at least about 12.
6. A chemical-mechanical polishing composition for polishing a tantalum containing substrate consisting essentially of:
(a) about 0.25 to about 5 percent by weight of a zirconia abrasive;
(b) about 0.25 to about 5 percent by weight of an alkali metal iodate salt; and
(c) an aqueous liquid carrier therefor;
the composition having a pH of at least about 10.
7. The composition of claim 6 wherein the alkali metal iodate salt comprises potassium iodate.
8. A chemical-mechanical polishing composition for polishing a tantalum containing substrate consisting essentially of:
(a) about 0.25 to about 5 percent by weight of a fumed alumina abrasive;
(b) about 0.25 to about 5 percent by weight of an alkali metal iodate salt; and
(c) an aqueous liquid carrier therefor;
the composition having a pH of at least about 12.
9. The composition of claim 8 wherein the alkali metal iodate salt comprises potassium iodate.
10. A method for chemical-mechanical polishing a tantalum-containing substrate comprising:
abrading a surface of a tantalum-containing substrate with a polishing composition of claim 1 .
11. The method of claim 10 wherein the alkali metal iodate salt is potassium iodate.
12. The method of claim 10 wherein the abrasive is present in the composition in an amount in the range of about 0.25 to about 5 percent by weight.
13. The method of claim 10 wherein the alkali metal iodate salt is present in the composition in an amount in the range of about 0.25 to about 5 percent by weight.
14. The method of claim 10 wherein the alkali metal iodate salt comprises potassium iodate.
15. The method of claim 10 wherein the composition has a pH of at least about 12.
16. The method of claim 10 wherein the abrasive is zirconia.
17. The method of claim 10 wherein the abrasive is fumed alumina.
18. The method of claim 10 wherein the substrate further comprises copper.
19. The method of claim 18 wherein the substrate further comprises a silicon oxide material.
20. The method of claim 10 wherein the substrate further comprises a silicon oxide material.