Integrated circuit package and system interface
View Patent ↗A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.
1. A method for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:
adding a fissure to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low frequency ranges;
thereafter connecting said fissure to an AC ground; and
configuring a top wall of said fissure utilizing a heat spreader layer in order to form an improved IC package based on said FC package in association with said fissure and said top wall thereof.
2. The method of claim 1 , further comprising:
accommodating an ingress of an optical fiber with said fissure in order to provide for a direct interface of said optical fiber with a transceiver;
driving a high speed signal trace utilizing an on-chip integrated light emitting device; and
improving a frequency response of said high speed signal trace by selectively depositing a low dielectric material.
3. The method of claim 2 wherein said light emitting device comprises a light emitting diode (LED).
4. The method of claim 2 wherein said optical fiber permits a removal of at least one solder ball from said high speed signal trace.
5. The method of claim 2 wherein said high speed signal trace comprises said fissure.
6. The method of claim 1 wherein said fissure extends a frequency range of said FC package.
7. The method of claim 1 further comprising:
forming said fissure utilizing a conductive material in order to connect said fissure to said AC ground.
8. The method of claim 1 further comprising:
associating a loop coupling with said improved IC package, wherein at least one I/O connected to said improved IC package drives said loop coupling.
9. The method of claim 8 wherein said loop coupling comprises an input to waveguide associated with said improved IC package and wherein said waveguide joins another waveguide which is configured on a PCB.
10. A method for enhancing the performance and extending the frequency range of integrated circuit packages, comprising:
adding a fissure to a Flip-Chip (FC) package in order to improve a cross talk performance of said FC package for high and low frequency ranges;
thereafter connecting said fissure to an AC ground;
configuring a top wall of said fissure utilizing a heat spreader layer;
accommodating an ingress of an optical fiber with said fissure in order to provide for a direct interface of said optical fiber with a transceiver;
driving a high speed signal trace utilizing an on-chip integrated light emitting device; and
improving a frequency response of said high speed signal trace by selectively depositing a low dielectric material in order to form an improved IC package based on said FC package in association with said fissure and said top wall thereof.
11. The method of claim 10 further comprising:
associating a loop coupling with said improved IC package, wherein at least one I/O connected to said improved IC package drives said loop coupling.
12. The method of claim 11 wherein said loop coupling comprises an input to waveguide associated with said improved IC package and wherein said waveguide joins another waveguide which is configured on a PCB.