IP Library Granted Patent US 8,057,561
Granted Patent B2
US 8,057,561 · App. 11/518,674 · Granted Nov 15, 2011

Polyoxometalate compositions and methods

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Quick Facts
Patent No.
US 8,057,561
App. No.
11/518,674
Granted
Nov 15, 2011
Kind
B2
Abstract

The invention provides an isolated, particulate polyoxometalate complex comprising a water-soluble cationic polymer and a polyoxometalate compound ionically bound to the cationic polymer. The polyoxometalate compound can be an isopolyoxometalate compound, such as an isopolytungstate, or a heteropolyoxometalate compound. The invention further provides a chemical-mechanical polishing composition comprising a preformed polyoxometalate abrasive, as well as a method of chemically-mechanically polishing a substrate therewith.

Claims (33)

1. An abrasive particle comprising a polyoxometalate complex and a metal oxide core, wherein the polyoxometalate complex is a polyoxometalate compound ionically bound to a cationic polymer, wherein the metal oxide core is surrounded by a coating comprising the polyoxometalate complex, and the mean particle size of the abrasive particle is in the range of about 100 nm to about 5000 nm, as determined by light scattering.

2. The abrasive particle of claim 1 wherein the polyoxometalate compound comprises an isopolyoxometalate compound.

3. The abrasive particle of claim 1 wherein the polyoxometalate compound comprises a heteropolyoxometalate compound.

4. The abrasive particle of claim 1 wherein the cationic polymer comprises a quaternary ammonium-substituted polymer.

5. The abrasive particle of claim 1 wherein the cationic polymer comprises poly(methacryloxyethyltrimethylammonium chloride).

6. The abrasive particle of claim 1 wherein the metal oxide core comprises silica.

7. Theabrasive particle of claim 1 wherein the polyoxometalate compound comprises an isopolytungstate compound.

8. The abrasive particle of claim 7 wherein the complex is free from tetraperoxotungstate as determined by FT-IR.

9. The abrasive particle of claim 7 wherein the cationic polymer comprises a water soluble quaternary ammonium polymer.

10. The abrasive particle of claim 1 wherein the polyoxometalate compound comprises a polytitanate compound.

11. The abrasive particle of claim 10 wherein the cationic polymer comprises a water soluble quaternary ammonium polymer.

12. A chemical-mechanical polishing (CMP) composition comprising:

(a) preformed abrasive particles comprising a polyoxometalate complex and a metal oxide core, wherein the polyoxometalate complex is a polyoxometalate compound ionically bound to a cationic polymer, wherein the metal oxide core is surrounded by a coating comprising the polyoxometalate complex, and the mean particle size of the abrasive particle is in the range of about 100 nm to about 5000 nm, as determined by light scattering; and

(b) one or more oxidizing agents suitable for use in CMP; and

(c) an aqueous carrier;

wherein the composition has a pH of about 3 or less.

13. The CMP composition of claim 12 wherein the metal oxide core comprises silica.

14. The CMP composition of claim 12 wherein the polyoxometalate compound comprises an isopolytungstate compound.

15. The CMP composition of claim 12 wherein the polyoxometalate compound comprises a polytitanate compound.

16. The CMP composition of claim 12 wherein the cationic polymer comprises a quaternary ammonium-substituted polymer.

17. The CMP composition of claim 12 wherein the abrasive particles are present in the composition in an amount in the range of about 0.01 to about 5 percent by weight.

18. The CMP composition of claim 12 further comprising an auxiliary abrasive selected from the group consisting of silica, alumina, titania, zirconia, and ceria.

19. A method for polishing a substrate comprising abrading a surface of the substrate with the abrasive particle of claim 1 .

20. A chemical-mechanical polishing (CMP) method for polishing a substrate, the method comprising the steps of:

(a) contacting a surface of a substrate with a polishing pad an aqueous CMP composition, the CMP composition having a pH of about 3 or less and including preformed abrasive particles comprising a polyoxometalate complex and a metal oxide core, wherein the polyoxometalate complex is a polyoxometalate compound ionically bound to a cationic polymer, wherein the metal oxide core is surrounded by a coating comprising the polyoxometalate complex, and the mean particle size of the abrasive particle is in the range of about 100 nm to about 5000 nm, as determined by light scattering; and

(b) causing relative motion between the polishing pad and the substrate while maintaining a portion of the CMP composition in contact with the surface between the pad and the substrate for a time period sufficient to abrade at least a portion of the surface.

21. The method of claim 20 wherein the metal oxide core comprises silica.

22. The method of claim 20 wherein the polyoxometalate compound comprises an isopolytungstate compound.

23. The method of claim 20 wherein the polyoxometalate compound comprises a polytitanatecompound.

24. The method of claim 20 wherein the cationic polymer comprises a quaternary ammonium-substituted polymer.

25. The method of claim 20 wherein the abrasive particles are present in the CMP composition in an amount of about 0.01 to about 5 percent by weight.

26. The method of claim 20 wherein the CMP composition further comprises an auxiliary abrasive selected from the group consisting of silica, alumina, titania, zirconia, and ceria.

27. The method of claim 20 wherein the CMP composition further comprises an oxidizing agent.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
RELEASE OF SECURITY INTEREST Recorded Nov 16, 2018
From: BANK OF AMERICA, N.A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047587/0119 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →
NOTICE OF SECURITY INTEREST IN PATENTS Recorded Feb 16, 2012
From: CABOT MICROELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 027727/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2006
From: WHITE, DANIELA; PARKER, JOHN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 018402/0369 →