Integrated circuit package system
View Patent ↗An integrated circuit package system is provided including forming an external interconnect having a lead body and a lead tip, forming a lead protrusion in the lead tip, connecting a device and the external interconnect, and encapsulating the device and the external interconnect.
1. A method of manufacture of an integrated circuit package system comprising:
forming an external interconnect having a lead body and a lead tip thinner than the lead body;
forming a lead protrusion in the thinned lead tip, the lead protrusion having a top recess with a bottom extent opposite the top recess below the thinned lead tip and above a bottom extent of the lead body;
connecting a device and the external interconnect; and
encapsulating the device and the external interconnect.
2. The method as claimed in claim 1 wherein forming the lead protrusion includes forming the lead protrusion having a lead protrusion height with a maximum value below an inner body thickness of the lead body.
3. The method as claimed in claim 1 wherein encapsulating the device and the external interconnect includes not encapsulating the lead protrusion.
4. The method as claimed in claim 1 further comprising forming dual rows of external interconnects.
5. The method as claimed in claim 1 wherein forming the lead protrusion in the lead tip includes forming the lead protrusion in a mold.
6. A method of manufacture of an integrated circuit package system comprising:
forming an inner lead and an outer lead;
forming an inner lead body and an inner lead tip from the inner lead, the inner lead tip thinner than the inner lead body;
forming a lead protrusion in the thinned inner lead tip, the lead protrusion having a top recess with a bottom extent opposite the top recess below the inner lead tip and above a bottom extent of the lead body;
connecting a device with the inner lead and the outer lead; and
encapsulating the device, the inner lead, and the outer lead.
7. The method as claimed in claim 6 wherein forming the inner lead and the outer lead includes forming the inner lead and the outer lead adjacent to each other.
8. The method as claimed in claim 6 further comprising forming an outer lead body and an outer lead tip from the outer lead.
9. The method as- claimed in claim 6 wherein connecting the device with the inner lead and outer lead includes connecting an integrated circuit die with the inner lead and outer lead.
10. The method as claimed in claim 6 wherein forming the lead protrusion in the lead tip includes:
forming a top chase having a first protrusion of a mold;
forming a bottom chase having a second protrusion of the mold; and
clamping the top chase and the bottom chase for forming the lead protrusion.
11. An integrated circuit package system comprising:
an external interconnect having a lead body and a lead tip thinner than the lead body;
a lead protrusion in the thinned lead tip, the lead protrusion having a top recess with a bottom extent opposite the top recess below the thinned lead tip and above a bottom extent of the lead body;
an internal interconnect between a device and the external interconnect; and
an encapsulation of the device and the external interconnect.
12. The system as claimed in claim 11 wherein the external interconnect is a lead.
13. The system as claimed in claim 11 wherein the lead protrusion has a lead protrusion height with a maximum value below a body thickness of the lead body.
14. The system as claimed in claim 11 wherein the encapsulation of the device and the external interconnect does not cover the lead protrusion.
15. The system as claimed in claim 11 further comprising dual rows of external interconnects.
16. The system as claimed in claim 11 further comprising:
an inner lead having an inner lead body and an inner lead tip from the inner lead,
wherein:
the inner lead tip has a lead protrusion,
the inner lead is connected to the device with the internal interconnect, and
the inner lead is covered by the encapsulation; and
an outer lead, wherein the outer lead is connected to the device with the internal interconnect and covered by the encapsulation.
17. The system as claimed in claim 16 wherein the internal interconnect is a bond wire.
18. The system as claimed in claim 16 wherein the inner lead and the outer lead are adjacent to each other.
19. The system as claimed in claim 16 wherein the outer lead has an outer lead body and an outer lead tip.
20. The system as claimed in claim 16 wherein the device is an integrated circuit die.